Inventor · disambiguated record
Duane Thomas Wilcoxen
Also filed as: WILCOXEN DUANE · WILCOXEN DUANE T · WILCOXEN DUANE THOMAS
6 granted patents·4 pending applications·151 citations·filing 1990–2024
83Inventor score
Top patents by PatentIndex Score
10 records- 0194US8035226B1Wafer level package integrated circuit incorporating solder balls containing an organic plastic-coreMAXIM INTEGRATED PRODUCTS·Filed 2008·Granted Oct 11, 2011·57 cites·24 claims
- 0293US8575493B1Integrated circuit device having extended under ball metallizationXU YONG LI·Filed 2011·Granted Nov 5, 2013·41 cites·8 claims
- 0378US12308337B1Power semiconductor apparatus and bonding method thereofDIODES INC·Filed 2024·Granted May 20, 2025·0 cites·19 claims
- 0475US9093333B1Integrated circuit device having extended under ball metallizationMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Jul 28, 2015·3 cites·6 claims
- 0569US5059556ALow stress polysilicon microstructuresSIEMENS BENDIX AUTOMOTIVE ELEC·Filed 1990·Granted Oct 22, 1991·50 cites·14 claims
- 0646US2010072615A1High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture ThereofMAXIM INTEGRATED PRODUCTS·Filed 2008·Application pending·0 cites
- 0743US11251152B2Thinned semiconductor chip with edge supportDIODES INC·Filed 2020·Granted Feb 15, 2022·0 cites·14 claims
- 0843US2016225733A1Chip Scale PackageDIODES INC·Filed 2014·Application pending·0 cites
- 0931US2011233756A1Wafer level packaging with heat dissipationMAXIM INTEGRATED PRODUCTS·Filed 2010·Application pending·0 cites
- 1031US2017011979A1Chip Scale PackageDIODES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →