Inventor · disambiguated record
Dwayne Richard Shirley
Also filed as: SHIRLEY DWAYNE R · SHIRLEY DWAYNE RICHARD
5 granted patents·7 pending applications·4 citations·filing 2012–2025
66Inventor score
Files withMARVELL ASIA PTE LTD8INPHI CORP1QUALCOMM INC1SHIRLEY DWAYNE RICHARD1TEXAS INSTRUMENTS INC1
Top patents by PatentIndex Score
12 records- 0164US9190341B2Lidded integrated circuit packageSHIRLEY DWAYNE RICHARD·Filed 2012·Granted Nov 17, 2015·3 cites·10 claims
- 0262US2025201663A1Reflowable Vapor Chamber LidMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 0358US9793190B2Lid for integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2015·Granted Oct 17, 2017·1 cites·8 claims
- 0458US2024250068A1Mechanical stiffener for integrated circuit package with varying heat dissipation modesMARVELL ASIA PTE LTD·Filed 2024·Application pending·0 cites
- 0555US2025231357A1Data Communication DeviceMARVELL ASIA PTE LTD·Filed 2025·Application pending·0 cites
- 0654US2025343161A1Warpage mitigation in a cluster of multiple high bandwidth memory stacksMARVELL ASIA PTE LTD·Filed 2025·Application pending·0 cites
- 0752US2025341674A1Low loss and stable planar lightwave circuit attachment with silicon interposerMARVELL ASIA PTE LTD·Filed 2023·Application pending·0 cites
- 0851US12021003B2Semiconductor device package with semiconductive thermal pedestalMARVELL ASIA PTE LTD·Filed 2021·Granted Jun 25, 2024·0 cites·17 claims
- 0949US11694971B1Electro-optic package featuring sputtered EMI shieldMARVELL ASIA PTE LTD·Filed 2021·Granted Jul 4, 2023·0 cites·12 claims
- 1047US2022344297A1Semiconductor package inhibiting viscous material spreadINPHI CORP·Filed 2021·Application pending·0 cites
- 1145US2025285934A1Thermally-conductive crystalline pedestal for semiconductor device packagesMARVELL ASIA PTE LTD·Filed 2025·Application pending·0 cites
- 1241US9768108B2Conductive post protection for integrated circuit packagesQUALCOMM INC·Filed 2015·Granted Sep 19, 2017·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →