Inventor · disambiguated record
E. C. Ong
Also filed as: ONG E C
4 granted patents·3 pending applications·114 citations·filing 1997–2001
80Inventor score
Top patents by PatentIndex Score
7 records- 0175US6347947B1Method and apparatus for protecting and strengthening electrical contact interfacesADVANCED INTERCONNECT SOLUTION·Filed 2000·Granted Feb 19, 2002·19 cites·2 claims
- 0272US5766535APressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuitsINTEGRATED PACKAGING ASSEMBLY·Filed 1997·Granted Jun 16, 1998·44 cites·7 claims
- 0369US5958466APressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuitsIPAC INC·Filed 1998·Granted Sep 28, 1999·38 cites·6 claims
- 0465US6296169B1Flux-application fixture for a ball-grid-array (BGA) assembly processADVANCED INTERCONNECT SOLUTION·Filed 2000·Granted Oct 2, 2001·13 cites·4 claims
- 0534US2002064931A1Method and apparatus for applying a protective over-coating to a ball-grid-array (BGA) structureFiled 2000·Application pending·0 cites
- 0634US2002001981A1Method and apparatus for protecting and strengthening electrical contact interfacesFiled 2000·Application pending·0 cites
- 0732US2002013071A1Final testing of IC die in wafer formFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →