Inventor · disambiguated record
E. Mikhail Sagal
Also filed as: SAGAL E M · SAGAL E MIKHAIL
30 granted patents·10 pending applications·1,041 citations·filing 2000–2016
98Inventor score
Files withCOOL OPTIONS INC17COOL SHIELD INC7COOL OPTIONS INC A NEW HAMPSHI2SAGAL E MIKHAIL2THERMAL SOLUTION RESOURCES LLC2
Top patents by PatentIndex Score
40 records- 0198US7235918B2Thermally-conductive plastic articles having light reflecting surfacesCOOL OPTIONS INC·Filed 2003·Granted Jun 26, 2007·174 cites·7 claims
- 0297US6886625B1Elastomeric heat sink with a pressure sensitive adhesive backingCOOL OPTIONS INC·Filed 2002·Granted May 3, 2005·58 cites·6 claims
- 0395US8497515B1LED device with thermoelectric moduleSAGAL E MIKHAIL·Filed 2010·Granted Jul 30, 2013·18 cites·8 claims
- 0494US6976769B2Light-emitting diode reflector assembly having a heat pipeCOOL OPTIONS INC·Filed 2003·Granted Dec 20, 2005·101 cites·23 claims
- 0594US6487073B2Thermally conductive electronic device caseCOOL OPTIONS INC·Filed 2000·Granted Nov 26, 2002·83 cites·9 claims
- 0694US6385047B1U-shaped heat sink assemblyCOOL SHIELD INC·Filed 2000·Granted May 7, 2002·83 cites·12 claims
- 0793US8827508B2Overmolded LED light assembly and method of manufactureSAGAL E MIKHAIL·Filed 2010·Granted Sep 9, 2014·15 cites·27 claims
- 0891US7476702B2Polymer electronic device package having high thermal conductivity and dielectric strengthCOOL OPTIONS INC·Filed 2005·Granted Jan 13, 2009·17 cites·5 claims
- 0990US7462309B2Method for making thermoplastic thermally-conductive interface articlesCOOL SHIELD INC·Filed 2004·Granted Dec 9, 2008·28 cites·11 claims
- 1090US6981805B2Molded electronic connector formed from a thermally conductive polymer composition and method of making the sameCOOL OPTIONS INC·Filed 2004·Granted Jan 3, 2006·39 cites·22 claims
- 1190US6620497B2Polymer composition with boron nitride coated carbon flakesCOOL OPTIONS INC·Filed 2001·Granted Sep 16, 2003·42 cites·2 claims
- 1289US6685855B1Method of making thermally-conductive casings for optical heads in optical disc playersCOOL OPTIONS INC·Filed 2003·Granted Feb 3, 2004·32 cites·5 claims
- 1388US6651732B2Thermally conductive elastomeric heat dissipation assembly with snap-in heat transfer conduitCOOL SHIELD INC·Filed 2002·Granted Nov 25, 2003·52 cites·17 claims
- 1487US9332621B2LED lamps with enhanced wireless communicationTHERMAL SOLUTION RESOURCES LLC·Filed 2014·Granted May 3, 2016·12 cites·20 claims
- 1587US6611660B1Radial fin thermal transfer element and method of manufacturing sameCOOL OPTIONS INC A NEW HAMPSHI·Filed 2002·Granted Aug 26, 2003·44 cites·11 claims
- 1686US6585039B2Composite overmolded heat pipe constructionCOOL OPTIONS INC·Filed 2001·Granted Jul 1, 2003·38 cites·9 claims
- 1785US9603226B2LED lamps with enhanced wireless communicationTHERMAL SOLUTION RESOURCES LLC·Filed 2016·Granted Mar 21, 2017·6 cites·20 claims
- 1883US6827470B2Thermally conductive lamp reflectorCOOL OPTINS INC·Filed 2002·Granted Dec 7, 2004·40 cites·10 claims
- 1982US6710109B2Thermally conductive and high strength injection moldable compositionCOOL OPTIONS INC A NEW HAMPSHI·Filed 2001·Granted Mar 23, 2004·16 cites·10 claims
- 2081US7094822B2Thermally conductive elastomeric padCOOL SHIELD INC·Filed 2004·Granted Aug 22, 2006·21 cites·5 claims
- 2179US6835347B2Method of forming a highly thermally conductive and high strength articleCOOL OPTIONS INC·Filed 2003·Granted Dec 28, 2004·11 cites·11 claims
- 2276US6986435B2Self-heating food and beverage container made from a thermally conductive polymer compositionCOOL OPTIONS INC·Filed 2002·Granted Jan 17, 2006·20 cites·12 claims
- 2375US7038009B2Thermally conductive elastomeric pad and method of manufacturing sameCOOL SHIELD INC·Filed 2002·Granted May 2, 2006·15 cites·5 claims
- 2474US6851869B2Highly thermally conductive electronic connectorCOOL OPTIONS INC·Filed 2001·Granted Feb 8, 2005·15 cites·6 claims
- 2574US6547001B2Flexible glove-like heat sinkCOOL SHIELD INC·Filed 2002·Granted Apr 15, 2003·21 cites·11 claims
- 2672US6681487B2Method of manufacturing a composite overmolded heat pipeCOOL OPTIONS INC·Filed 2002·Granted Jan 27, 2004·15 cites·19 claims
- 2759US6620366B2Method of making a capacitor post with improved thermal conductivityCOOL OPTIONS INC·Filed 2001·Granted Sep 16, 2003·8 cites·5 claims
- 2857US6649108B2Method of manufacturing a U-shaped heat sink assemblyCOOL SHIELD INC·Filed 2001·Granted Nov 18, 2003·6 cites·2 claims
- 2956US6587330B1Capacitor post with improved thermal conductivityCOOL OPTIONS INC·Filed 2002·Granted Jul 1, 2003·6 cites·21 claims
- 3056US2005209383A1Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing sameMILLER JAMES D·Filed 2005·Application pending·0 cites
- 3153US6543524B2Overplated thermally conductive part with EMI shieldingCOOL OPTIONS INC·Filed 2001·Granted Apr 8, 2003·5 cites·8 claims
- 3251US2003236335A1Thermally-conductive plastic substrates for electronic circuits and methods of manufacturing sameFiled 2003·Application pending·0 cites
- 3351US2005110380A1Method for making thermally-conductive plastic articles having light reflecting surfacesCOOL OPTIONS INC·Filed 2004·Application pending·0 cites
- 3449US2003139510A1Polymer compositions having high thermal conductivity and dielectric strength and molded packaging assemblies produced therefromFiled 2002·Application pending·0 cites
- 3548US2003220432A1Thermoplastic thermally-conductive interface articlesFiled 2003·Application pending·0 cites
- 3648US2004226707A1Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backingFiled 2004·Application pending·0 cites
- 3743US2003040563A1Substantially non-abrasive thermally conductive polymer composition containing boron nitrideFiled 2002·Application pending·0 cites
- 3843US2003199082A1Thermally-conductive biological assay traysFiled 2003·Application pending·0 cites
- 3936US2002062949A1Overplated thermally conductive part with EMI sheildingFiled 2000·Application pending·0 cites
- 4036US2001023762A1Heat pipe spreader constructionFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →