Inventor · disambiguated record
Edward G. Bundga
Also filed as: BUNDGA EDWARD G
3 granted patents·108 citations·filing 1993–2001
76Inventor score
Files withIBM3
Top patents by PatentIndex Score
3 records- 0189US6425772B1Conductive adhesive having a palladium matrix interface between two metal surfacesIBM·Filed 2001·Granted Jul 30, 2002·59 cites·14 claims
- 0268US5281150AMethod and apparatus for connecting cable to the surface of printed circuit boards or the likeIBM·Filed 1993·Granted Jan 25, 1994·35 cites·20 claims
- 0350US6331119B1Conductive adhesive having a palladium matrix interface between two metal surfacesIBM·Filed 1999·Granted Dec 18, 2001·14 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →