Inventor · disambiguated record
Edmund Sales Cabatbat
Also filed as: CABATBAT EDMUND SALES
7 granted patents·1 pending application·5 citations·filing 2014–2023
73Inventor score
Top patents by PatentIndex Score
8 records- 0190US11652078B2High voltage semiconductor package with pin fit leadsINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 16, 2023·3 cites·17 claims
- 0259US10083899B2Semiconductor package with heat slug and rivet free die attach areaINFINEON TECHNOLOGIES AG·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 0356US10971436B2Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 0454US10354943B1Multi-branch terminal for integrated circuit (IC) packageINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jul 16, 2019·0 cites·20 claims
- 0553US9048397B2Color yield of white LEDsCARSEM M SDN BHD·Filed 2014·Granted Jun 2, 2015·1 cites·20 claims
- 0652US2024087992A1Chip package, chip system, method of forming a chip package, and method of forming a chip systemINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0750US11417538B2Semiconductor package including leads of different lengthsINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 16, 2022·0 cites·10 claims
- 0839US10840164B2Wire bonded package with single piece exposed heat slug and leadsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Edmund Sales Cabatbat files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →