Inventor · disambiguated record
Edward C. Carignan
Also filed as: CARIGNAN EDWARD · CARIGNAN EDWARD C · CARIGNAN EDWARD CHARLES
8 granted patents·2 pending applications·36 citations·filing 2000–2024
81Inventor score
Top patents by PatentIndex Score
10 records- 0195US11751330B2Magnetic material filled printed circuit boards and printed circuit board statorsE CIRCUIT MOTORS INC·Filed 2022·Granted Sep 5, 2023·8 cites·15 claims
- 0293US11800640B1Printed circuit board dielectric molding and electrolytic metallizationINFINITUM ELECTRIC INC·Filed 2023·Granted Oct 24, 2023·2 cites·21 claims
- 0391US11750071B1Printed circuit board stator winding enhancements for axial field rotary energy deviceINFINITUM ELECTRIC INC·Filed 2022·Granted Sep 5, 2023·1 cites·16 claims
- 0488US12004306B1Method of printed circuit board dielectric molding and electrolytic metallizationINFINITUM ELECTRIC INC·Filed 2023·Granted Jun 4, 2024·1 cites·12 claims
- 0580US12219698B2Printed circuit board dielectric molding, machining and electrolytic metallizationINFINITUM ELECTRIC INC·Filed 2023·Granted Feb 4, 2025·0 cites·21 claims
- 0677US12495493B2Magnetic material filled printed circuit boards and printed circuit board statorsE CIRCUIT MOTORS INC·Filed 2022·Granted Dec 9, 2025·0 cites·14 claims
- 0775US12336113B2Method of printed circuit board dielectric molding or machining and electrolytic metallizationINFINITUM ELECTRIC INC·Filed 2024·Granted Jun 17, 2025·0 cites·8 claims
- 0872US6584820B1Surface enhanced metal press plates for use in manufacture of laminates and multilayer materials and method of making samePOLYCLAD LAMINATES INC·Filed 2000·Granted Jul 1, 2003·24 cites·32 claims
- 0961US2025133654A1Printed circuit board dielectric molding, machining and wire insertionINFINITUM ELECTRIC INC·Filed 2024·Application pending·0 cites
- 1058US2024334595A1Printed circuit board dielectric molding or machining and electrolytic metallizationINFINITUM ELECTRIC INC·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →