Inventor · disambiguated record
Edward J. Choinski
Also filed as: CHOINSKI EDWARD J · CLAPP ROGER C
15 granted patents·598 citations·filing 1977–1987
95Inventor score
Top patents by PatentIndex Score
15 records- 0198US4113903AMethod of multilayer coatingPOLAROID CORP·Filed 1977·Granted Sep 12, 1978·79 cites·6 claims
- 0296US4938994AMethod and apparatus for patch coating printed circuit boardsEPICOR TECHNOLOGY INC·Filed 1987·Granted Jul 3, 1990·186 cites·124 claims
- 0390US4497121AProcess simulatorPOLAROID CORP·Filed 1983·Granted Feb 5, 1985·30 cites·50 claims
- 0490US4489671ACoating apparatusPOLAROID CORP·Filed 1983·Granted Dec 25, 1984·54 cites·4 claims
- 0587US4700474AApparatus and method for temporarily sealing holes in printed circuit boardsMULTITEK CORP·Filed 1986·Granted Oct 20, 1987·61 cites·8 claims
- 0686US4154879AMethod and apparatus for coating webs with a plurality of liquid layersPOLAROID CORP·Filed 1977·Granted May 15, 1979·19 cites·12 claims
- 0782US4143190AMethod and apparatus for coating websPOLAROID CORP·Filed 1977·Granted Mar 6, 1979·32 cites·10 claims
- 0873US4283443AMethod and apparatus for coating websPOLAROID CORP·Filed 1977·Granted Aug 11, 1981·23 cites·15 claims
- 0970US4884337AMethod for temporarily sealing holes in printed circuit boards utilizing a thermodeformable materialEPICOR TECHNOLOGY INC·Filed 1987·Granted Dec 5, 1989·28 cites·102 claims
- 1063US4756856AMethod of and apparatus for forming surface of magnetic mediaPOLAROID CORP·Filed 1984·Granted Jul 12, 1988·22 cites·9 claims
- 1162US4777721AApparatus and method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable materialMULTITEK CORP·Filed 1987·Granted Oct 18, 1988·23 cites·6 claims
- 1262US4415610AProcess simulatorPOLAROID CORP·Filed 1981·Granted Nov 15, 1983·18 cites·7 claims
- 1348US4241171AHardener in carrier layerPOLAROID CORP·Filed 1979·Granted Dec 23, 1980·10 cites·7 claims
- 1443US4362122AFluid dispensing systemPOLAROID CORP·Filed 1981·Granted Dec 7, 1982·8 cites·10 claims
- 1534US4748742AMethod for temporarily sealing holes in printed circuit boardsMULTITEK CORP·Filed 1986·Granted Jun 7, 1988·5 cites·84 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →