Inventor · disambiguated record
Edwin Chu
Also filed as: CHU EDWIN
4 granted patents·380 citations·filing 1994–1996
83Inventor score
Files withACC MICROELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0192US5801440AChip package board having utility ringsACC MICROELECTRONICS CORP·Filed 1995·Granted Sep 1, 1998·238 cites·22 claims
- 0280US5686699ASemiconductor board providing high signal pin utilizationACC MICROELECTRONICS CORP·Filed 1996·Granted Nov 11, 1997·75 cites·19 claims
- 0374US5508653AMulti-voltage circuit arrangement and method for accommodating hybrid electronic system requirementsACC MICROELECTRONICS CORP·Filed 1994·Granted Apr 16, 1996·31 cites·14 claims
- 0464US5703402AOutput mapping of die pad bonds in a ball grid arrayACC MICROELECTRONICS CORP·Filed 1995·Granted Dec 30, 1997·36 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →