Inventor · disambiguated record
Eduardo De Mesa
Also filed as: DE MESA EDUARDO
1 granted patent·13 pending applications·0 citations·filing 2022–2023
10Inventor score
Technology areasH10W
Files withINTEL CORP14
Top patents by PatentIndex Score
14 records- 0157US12476176B2Glass core substrate printed circuit board for warpage reductionINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 0254US2025210456A1Active Cooling for Heterogenous PackagesINTEL CORP·Filed 2023·Application pending·0 cites
- 0354US2025210428A1Stiffener assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0453US2025112206A1Die placement within a formed cavity on a redistribution layerINTEL CORP·Filed 2023·Application pending·0 cites
- 0548US2023317705A1Thin client form factor assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 0648US2023317681A1Three-dimensional stack cooling wingsINTEL CORP·Filed 2022·Application pending·0 cites
- 0748US2023317620A1Interposers for semiconductor devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0848US2023317618A1Glass bridge for connecting diesINTEL CORP·Filed 2022·Application pending·0 cites
- 0948US2023317551A1Heterogeneous packages having thermal towersINTEL CORP·Filed 2022·Application pending·0 cites
- 1047US2023299043A1Packaging architecture with thermally conductive integrated circuit bridgeINTEL CORP·Filed 2022·Application pending·0 cites
- 1146US2023282615A1Stacked die packaging architecture with conductive vias on interposerINTEL CORP·Filed 2022·Application pending·0 cites
- 1244US2023299014A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 1344US2023299013A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 1444US2023299012A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →