Inventor · disambiguated record
Edgardo Hortaleza
Also filed as: HORTALEZA EDGARDO · HORTALEZA EDGARDO R · HORTALEZA EDGARDO RULLODA
11 granted patents·16 pending applications·185 citations·filing 1997–2011
91Inventor score
Files withTEXAS INSTRUMENTS INC17HORTALEZA EDGARDO R3LI LEI3COSUE GLENN ENRICK CALDERON1MERCADO EMORY TONGOL1
Top patents by PatentIndex Score
27 records- 0182US6657311B1Heat dissipating flip-chip ball grid arrayTEXAS INSTRUMENTS INC·Filed 2002·Granted Dec 2, 2003·38 cites·30 claims
- 0278US5960262AStitch bond enhancement for hard-to-bond materialsTEXAS INSTRUMENTS INC·Filed 1998·Granted Sep 28, 1999·59 cites·23 claims
- 0377US7351651B2Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 1, 2008·7 cites·7 claims
- 0469US5984162ARoom temperature ball bondingTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 16, 1999·39 cites·19 claims
- 0567US7476597B2Methods and systems for laser assisted wirebondingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 13, 2009·3 cites·18 claims
- 0664US6182882B1Angled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframeTEXAS INSTRUMENTS INC·Filed 2000·Granted Feb 6, 2001·11 cites·10 claims
- 0751US2009029542A1Methods and systems for laser assisted wirebondingTEXAS INSTRUMENTS INC·Filed 2008·Application pending·0 cites
- 0848US7061114B2Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuitsTEXAS INSTRUMENTS INC·Filed 2004·Granted Jun 13, 2006·3 cites·18 claims
- 0946US6686291B1Undercut process with isotropic plasma etching at package levelTEXAS INSTRUMENTS INC·Filed 1997·Granted Feb 3, 2004·12 cites·6 claims
- 1046US6131792ABalancing of x and y axis bonding by 45 degree capillary positioningTEXAS INSTRUMENTS INC·Filed 2000·Granted Oct 17, 2000·2 cites·16 claims
- 1145US6112973AAngled transducer-dual head bonder for optimum ultrasonic power application and flexibility for tight pitch leadframeTEXAS INSTRUMENTS INC·Filed 1998·Granted Sep 5, 2000·11 cites·10 claims
- 1245US2007013047A1Enhanced PGA InterconnectionHORTALEZA EDGARDO R·Filed 2006·Application pending·0 cites
- 1345US2006094228A1Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuitsLI LEI·Filed 2005·Application pending·0 cites
- 1440US2005206007A1Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuitsLI LEI·Filed 2004·Application pending·0 cites
- 1540US2005215048A1Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuitsLI LEI·Filed 2004·Application pending·0 cites
- 1639US2006022327A1Enhanced PGA interconnectionTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 1738US2007085220A1Re-enforced ball-grid array packages for semiconductor productsHORTALEZA EDGARDO R·Filed 2005·Application pending·0 cites
- 1837US2004183167A1Recessed-bond semiconductor package substrateTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 1937US2005224987A1Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuitsHORTALEZA EDGARDO R·Filed 2004·Application pending·0 cites
- 2037US2012199960A1Wire bonding for interconnection between interposer and flip chip dieCOSUE GLENN ENRICK CALDERON·Filed 2011·Application pending·0 cites
- 2136US2004232562A1System and method for increasing bump pad heightTEXAS INSTRUMENTS INC·Filed 2003·Application pending·0 cites
- 2236US2005161791A1Multiple die-spacer for an integrated circuitTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 2334US2008111244A1Copper-metallized integrated circuits having an overcoat for protecting bondable metal contacts and improving mold compound adhesionTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 2434US2004012078A1Folded tape area array package with one metal layerFiled 2002·Application pending·0 cites
- 2533US2009206460A1Intermediate Bond Pad for Stacked Semiconductor Chip PackageREYES ELAINE BAUTISTA·Filed 2007·Application pending·0 cites
- 2629US6089443ABalancing of x and y axis bonding by 45 degree capillary positioningTEXAS INSTRUMENTS INC·Filed 1998·Granted Jul 18, 2000·0 cites·4 claims
- 2727US2011300673A1Post-dispense vacuum oven for reducing underfill voids during ic assemblyMERCADO EMORY TONGOL·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →