Inventor · disambiguated record
Edmund Law
Also filed as: LAW EDMUND
4 granted patents·32 citations·filing 2006–2011
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0194US8367475B2Chip scale package assembly in reconstitution panel process formatBROADCOM CORP·Filed 2011·Granted Feb 5, 2013·31 cites·20 claims
- 0250US8237262B2Method and system for innovative substrate/package design for a high performance integrated circuit chipsetLAW EDMUND·Filed 2010·Granted Aug 7, 2012·1 cites·14 claims
- 0342US7867816B2Method and system for innovative substrate/package design for a high performance integrated circuit chipsetBROADCOM CORP·Filed 2006·Granted Jan 11, 2011·0 cites·8 claims
- 0438US7858402B2Integrated circuit package having reversible ESD protectionBROADCOM CORP·Filed 2007·Granted Dec 28, 2010·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →