Inventor · disambiguated record
Edward Myers
Also filed as: MYERS EDWARD · MYERS EDWARD D · MYERS EDWARD DANIEL
9 granted patents·5 pending applications·248 citations·filing 1986–2025
86Inventor score
Files withINFINEON TECHNOLOGIES AG9ST MICROELECTRONICS SRL2CORTESE MARIO1CYPRESS SEMICONDUCTOR CORP1LINDMAN RICHARD S1
Top patents by PatentIndex Score
14 records- 0194US7875942B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2008·Granted Jan 25, 2011·31 cites·45 claims
- 0287US4882752AComputer security systemLINDMAN RICHARD S·Filed 1986·Granted Nov 21, 1989·210 cites·32 claims
- 0378US11088105B2Semiconductor device and method for fabricating a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0477US8546895B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeCORTESE MARIO·Filed 2011·Granted Oct 1, 2013·3 cites·46 claims
- 0576US8043881B2Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA typeST MICROELECTRONICS SRL·Filed 2010·Granted Oct 25, 2011·2 cites·21 claims
- 0665US11869865B2Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereofINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 9, 2024·0 cites·7 claims
- 0761US12388401B2Switchable NMOS-CMOS voltage-controlled oscillator (VCO) with shared inductor-capacitor (LC) tankCYPRESS SEMICONDUCTOR CORP·Filed 2023·Granted Aug 12, 2025·0 cites·19 claims
- 0854US2020020649A1Cavity based feature on chip carrierINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0953US2023095545A1Semiconductor Packages and Methods for Manufacturing ThereofINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1052US2025391744A1Semiconductor device including a coined diepadINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1147US2017317036A1Cavity based feature on chip carrierINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1242US11239127B2Topside-cooled semiconductor package with molded standoffINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 1342US9082737B2System and method for an electronic package with a fail-open mechanismINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·0 cites·24 claims
- 1438US2018218992A1Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →