Inventor · disambiguated record
Edward R. Pillai
Also filed as: PILLAI EDWARD · PILLAI EDWARD R
14 granted patents·1 pending application·232 citations·filing 2001–2020
93Inventor score
Top patents by PatentIndex Score
15 records- 0193US11011886B2Packaging of a directly modulated laser chip in photonics moduleINPHI CORP·Filed 2020·Granted May 18, 2021·4 cites·5 claims
- 0293US7265433B2On-pad broadband matching networkIBM·Filed 2005·Granted Sep 4, 2007·32 cites·17 claims
- 0391US10615567B1Packaging of a directly modulated laser chip in photonics moduleINPHI CORP·Filed 2018·Granted Apr 7, 2020·12 cites·7 claims
- 0487US6657864B1High density thermal solution for direct attach modulesIBM·Filed 2002·Granted Dec 2, 2003·52 cites·17 claims
- 0584US7085143B1In-module current sourceIBM·Filed 2005·Granted Aug 1, 2006·13 cites·20 claims
- 0681US7271681B2Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boardsIBM·Filed 2005·Granted Sep 18, 2007·12 cites·11 claims
- 0781US6806793B2MLC frequency selective circuit structuresIBM·Filed 2002·Granted Oct 19, 2004·25 cites·24 claims
- 0881US6680530B1Multi-step transmission line for multilayer packagingIBM·Filed 2002·Granted Jan 20, 2004·33 cites·23 claims
- 0980US6975199B2Embedded inductor and method of makingIBM·Filed 2001·Granted Dec 13, 2005·29 cites·15 claims
- 1063US6931712B2Method of forming a dielectric substrate having a multiturn inductorIBM·Filed 2004·Granted Aug 23, 2005·10 cites·10 claims
- 1161US7397261B2Monitoring system for detecting and characterizing classes of leakage in CMOS devicesIBM·Filed 2006·Granted Jul 8, 2008·3 cites·18 claims
- 1253US6501174B2Interconnect structure for surface mounted devicesIBM·Filed 2001·Granted Dec 31, 2002·5 cites·12 claims
- 1346US2011156730A1Chip-based prober for high frequency measurements and methods of measuringPILLAI EDWARD R·Filed 2011·Application pending·0 cites
- 1443US7956628B2Chip-based prober for high frequency measurements and methods of measuringIBM·Filed 2006·Granted Jun 7, 2011·0 cites·21 claims
- 1541US6583498B1Integrated circuit packaging with tapered striplines of constant impedanceIBM·Filed 2002·Granted Jun 24, 2003·2 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →