Inventor · disambiguated record
Ed A. Schrock
Also filed as: SCHROCK ED · SCHROCK ED A
20 granted patents·1 pending application·305 citations·filing 1990–2021
95Inventor score
Top patents by PatentIndex Score
21 records- 0188US5861678AMethod and system for attaching semiconductor dice to substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 19, 1999·85 cites·34 claims
- 0285US11222868B2Thermal transfer structures for semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2016·Granted Jan 11, 2022·4 cites·12 claims
- 0385US8062958B2Microelectronic device wafers and methods of manufacturingWOOD ALAN G·Filed 2009·Granted Nov 22, 2011·8 cites·26 claims
- 0481US5031360ABroken blade detector for semiconductor die sawsMICRON TECHNOLOGY INC·Filed 1990·Granted Jul 16, 1991·40 cites·19 claims
- 0570US6353268B1Semiconductor die attachment method and apparatusMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 5, 2002·31 cites·23 claims
- 0670US6221691B1Method and system for attaching semiconductor dice to substratesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 24, 2001·32 cites·21 claims
- 0770US6084311AMethod and apparatus for reducing resin bleed during the formation of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 4, 2000·37 cites·17 claims
- 0867US11862611B2Thermal transfer structures for semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 0963US6110805AMethod and apparatus for attaching a workpiece to a workpiece supportMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 29, 2000·19 cites·19 claims
- 1060US6174752B1Method and apparatus for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 16, 2001·16 cites·8 claims
- 1153US6016004AMethod and apparatus for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 18, 2000·12 cites·14 claims
- 1252US7153788B2Method and apparatus for attaching a workpiece to a workpiece supportMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 26, 2006·3 cites·10 claims
- 1351US8455983B2Microelectronic device wafers and methods of manufacturingWOOD ALAN G·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
- 1451US6719550B2Apparatus for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 13, 2004·3 cites·11 claims
- 1551US2007095280A1Method and apparatus for attaching a workpiece to a workpiece supportSCHROCK ED·Filed 2006·Application pending·0 cites
- 1649US6562277B1Method and apparatus for attaching a workpiece to a workpiece supportMICRON TECHNOLOGY INC·Filed 2000·Granted May 13, 2003·2 cites·12 claims
- 1747US6858469B1Method and apparatus for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 22, 2005·2 cites·7 claims
- 1846US6051449AMethod and apparatus for Epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 18, 2000·8 cites·8 claims
- 1942US7220616B2Methods for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 2004·Granted May 22, 2007·0 cites·53 claims
- 2035US6352422B1Method and apparatus for epoxy loc die attachmentMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 5, 2002·3 cites·12 claims
- 2130US7115976B1Method and apparatus for epoxy LOC die attachmentMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 3, 2006·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →