Inventor · disambiguated record
Edward Skorupski
Also filed as: SKORUPSKI EDWARD · SKORUPSKI EDWARD C
3 granted patents·1 pending application·132 citations·filing 2000–2001
74Inventor score
Files withOAK MITSUI INC3
Top patents by PatentIndex Score
4 records- 0193US6657849B1Formation of an embedded capacitor plane using a thin dielectricOAK MITSUI INC·Filed 2000·Granted Dec 2, 2003·93 cites·29 claims
- 0281US6610417B2Nickel coated copper as electrodes for embedded passive devicesOAK MITSUI INC·Filed 2001·Granted Aug 26, 2003·36 cites·24 claims
- 0346US6629348B2Substrate adhesion enhancement to filmOAK MITSUI INC·Filed 2001·Granted Oct 7, 2003·3 cites·32 claims
- 0435US2002130103A1Polyimide adhesion enhancement to polyimide filmFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →