Inventor · disambiguated record
Eden Zielinski
Also filed as: ZIELINSKI EDEN · ZIELINSKI EDEN M
10 granted patents·4 pending applications·244 citations·filing 1998–2009
91Inventor score
Files withTEXAS INSTRUMENTS INC7MICRON TECHNOLOGY INC3AGILENT TECHNOLOGIES INC1CHOI JIHONG1RAMAPPA DEEPAK A1
Top patents by PatentIndex Score
14 records- 0191US6734477B2Fabricating an embedded ferroelectric memory cellAGILENT TECHNOLOGIES INC·Filed 2001·Granted May 11, 2004·79 cites·10 claims
- 0282US6358849B1Integrated circuit interconnect and methodTEXAS INSTRUMENTS INC·Filed 1999·Granted Mar 19, 2002·66 cites·5 claims
- 0380US7186642B2Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 6, 2007·5 cites·10 claims
- 0480US6492267B1Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·19 cites·12 claims
- 0578US7214609B2Methods for forming single damascene via or trench cavities and for forming dual damascene via cavitiesTEXAS INSTRUMENTS INC·Filed 2002·Granted May 8, 2007·33 cites·7 claims
- 0658US8241927B2Methods relating to capacitive monitoring of layer characteristics during back end-of the-line processingCHOI JIHONG·Filed 2009·Granted Aug 14, 2012·1 cites·20 claims
- 0751US6984893B2Low temperature nitride used as Cu barrier layerMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 10, 2006·2 cites·5 claims
- 0851US6074943ASidewalls for guiding the via etchTEXAS INSTRUMENTS INC·Filed 1998·Granted Jun 13, 2000·15 cites·15 claims
- 0950US6251771B1Hydrogen passivation of chemical-mechanically polished copper-containing layersTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 26, 2001·16 cites·11 claims
- 1049US2007181532A1Cmp clean process for high performance copper/low-k devicesTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 1144US2009121353A1Dual damascene beol integration without dummy fill structures to reduce parasitic capacitanceRAMAPPA DEEPAK A·Filed 2007·Application pending·0 cites
- 1241US2005247675A1Treatment of dies prior to nickel silicide formationTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 1340US6246120B1Sidewalls for guiding the via etchTEXAS INSTRUMENTS INC·Filed 1999·Granted Jun 12, 2001·8 cites·9 claims
- 1435US2005045206A1Post-etch clean process for porous low dielectric constant materialsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →