Inventor · disambiguated record
Ee-Chang Ong
Also filed as: ONG EE CHANG
5 granted patents·54 citations·filing 1993–2000
80Inventor score
Top patents by PatentIndex Score
5 records- 0178US6534419B1Method and apparatus for reducing IC die mass and thickness while improving strength characteristicsADVANCED INTERCONNECT SOLUTION·Filed 2000·Granted Mar 18, 2003·34 cites·5 claims
- 0237US5452635AApparatus for integrated circuit lead-frame punchingINTEGRATED PACKAGING ASSEMBLY·Filed 1993·Granted Sep 26, 1995·8 cites·4 claims
- 0334US5495780AMethod for sharpening an IC lead-frame punchINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Mar 5, 1996·5 cites·5 claims
- 0430US6269723B1Method and apparatus for enhancement of a punch guide/receptor tool in a dambar removal systemINTEGRATED PACKAGING ASSEMBLY·Filed 1997·Granted Aug 7, 2001·4 cites·8 claims
- 0530US5497681AMethod for making an IC lead-frame punchINTEGRATED PACKAGING ASSEMBLY·Filed 1995·Granted Mar 12, 1996·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →