Inventor · disambiguated record
Egon Max Kummer
Also filed as: KUMMER EGON MAX
3 granted patents·289 citations·filing 1995–2000
79Inventor score
Technology areasH05K
Files withIBM3
Top patents by PatentIndex Score
3 records- 0196US6332569B1Etched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 2000·Granted Dec 25, 2001·97 cites·12 claims
- 0293US6231333B1Apparatus and method for vacuum injection moldingIBM·Filed 1995·Granted May 15, 2001·119 cites·20 claims
- 0391US6105852AEtched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 1998·Granted Aug 22, 2000·73 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →