Inventor · disambiguated record
Ehsan Zamani
Also filed as: ZAMANI EHSAN
0 granted patents·12 pending applications·0 citations·filing 2023–2024
Top patents by PatentIndex Score
12 records- 0161US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0258US2025218962A1Technologies for a stack of components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 0358US2025218956A1Methods and apparatus for mounting semiconductor devices in cavitiesINTEL CORP·Filed 2023·Application pending·0 cites
- 0458US2025218881A1Liquid-based method for embedding components in thick substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0557US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 0756US2025218929A1Embedded deep trench capacitors in integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0855US2025374426A1Automated manufacturing of hybrid panelsINTEL CORP·Filed 2024·Application pending·0 cites
- 0954US2025309148A1Substrate with component embedded in a blind cavityINTEL CORP·Filed 2024·Application pending·0 cites
- 1053US2025106997A1Electroless seed layer deposition on glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1153US2025014954A1Hybrid cores including adhesive promotion layers and related methodsAGARWAL SOHAM·Filed 2024·Application pending·0 cites
- 1251US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →