Inventor · disambiguated record
Eiji Anzai
Also filed as: ANZAI EIJI
12 granted patents·1 pending application·199 citations·filing 1998–2022
90Inventor score
Files withNIPPON LIGHT METAL CO4FUJI ELECTRIC CO LTD2KONICA MINOLTA BUSINESS TECH2KONISHIROKU PHOTO IND2NIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD2
Top patents by PatentIndex Score
13 records- 0194US5966574ADeveloper replenishing apparatusKONISHIROKU PHOTO IND·Filed 1998·Granted Oct 12, 1999·77 cites·14 claims
- 0291US7771137B2Connecting structure for hollow member or half hollow memberNISSAN MOTOR·Filed 2006·Granted Aug 10, 2010·34 cites·11 claims
- 0389US6539185B2Fixing apparatus and image-forming apparatusKONISHIROKU PHOTO IND·Filed 2001·Granted Mar 25, 2003·37 cites·10 claims
- 0482US7175173B2Finisher with increased conveyance speedKONICA MINOLTA BUSINESS TECH·Filed 2004·Granted Feb 13, 2007·21 cites·15 claims
- 0573US7341247B2Image forming apparatusKONICA MINOLTA BUSINESS TECH·Filed 2004·Granted Mar 11, 2008·12 cites·17 claims
- 0667US11624562B2Heat sinkFUJI ELECTRIC CO LTD·Filed 2022·Granted Apr 11, 2023·0 cites·4 claims
- 0760US2021102760A1Heat sinkFUJI ELECTRIC CO LTD·Filed 2020·Application pending·0 cites
- 0858USD798831SCooling device for an electronic component heat sinkNIPPON LIGHT METAL CO·Filed 2016·Granted Oct 3, 2017·8 cites·1 claims
- 0945US11278945B2Die set and working method using the die setNIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD·Filed 2018·Granted Mar 22, 2022·0 cites·11 claims
- 1045USD798829SCooling device for an electronic component heat sinkNIPPON LIGHT METAL CO·Filed 2016·Granted Oct 3, 2017·4 cites·1 claims
- 1145USD798830SCooling device for an electronic component heat sinkNIPPON LIGHT METAL CO·Filed 2016·Granted Oct 3, 2017·4 cites·1 claims
- 1243US12072155B2Heat exchanger having cured edgeNIPPON LIGHT METAL CO·Filed 2021·Granted Aug 27, 2024·0 cites·16 claims
- 1332USD914775SBending die for metal plateNIKKEIKIN ALUMINIUM CORE TECH COMPANY LTD·Filed 2018·Granted Mar 30, 2021·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →