Inventor · disambiguated record
Eing-Chieh Chen
Also filed as: CHEN EING-CHIEH
3 granted patents·333 citations·filing 2001–2002
78Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0194US6472741B1Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 29, 2002·230 cites·18 claims
- 0291US6716676B2Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Apr 6, 2004·91 cites·9 claims
- 0359US6650015B2Cavity-down ball grid array package with semiconductor chip solder ballSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Nov 18, 2003·12 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →