Inventor · disambiguated record
Eiji Dejima
Also filed as: DEJIMA EIJI
2 granted patents·1 pending application·0 citations·filing 2021–2022
25Inventor score
Technology areasH10P
Files withMITSUBISHI CHEM CORP3
Top patents by PatentIndex Score
3 records- 0157US12297376B2Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2021·Granted May 13, 2025·0 cites·18 claims
- 0257US11862470B2Silica particle and production method therefor, silica sol, polishing composition, polishing method, method for producing semiconductor wafer and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2021·Granted Jan 2, 2024·0 cites·16 claims
- 0345US2022363554A1Silica particle, silica sol, polishing composition, polishing method, method for producing semiconductor wafer, and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →