Inventor · disambiguated record
Eishi Gofuku
Also filed as: GOFUKU EISHI
13 granted patents·1 pending application·619 citations·filing 1987–2006
94Inventor score
Top patents by PatentIndex Score
14 records- 0197US4993148AMethod of manufacturing a circuit boardMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Feb 19, 1991·148 cites·12 claims
- 0293US5771158APrinted circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Jun 23, 1998·187 cites·18 claims
- 0385US5173844AIntegrated circuit device having a metal substrateMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 22, 1992·68 cites·4 claims
- 0484US5269868AMethod for separating bonded substrates, in particular disassembling a liquid crystal display deviceMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Dec 14, 1993·48 cites·6 claims
- 0580US5081562ACircuit board with high heat dissipations characteristicMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 14, 1992·53 cites·8 claims
- 0666US5459594AApparatus for inspecting on-off states of a scattering-type liquid crystal display panelMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Oct 17, 1995·29 cites·14 claims
- 0765US5012314ALiquid crystal display restoring apparatusMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Apr 30, 1991·30 cites·10 claims
- 0863US4785157AMethod for controlling electric resistance of a compound-type resistorsMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 15, 1988·12 cites·31 claims
- 0962US5059941AElectrode structure for a thick film resistorMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Oct 22, 1991·14 cites·2 claims
- 1041US2009014881A1Semiconductor device, and method and apparatus for manufacturing sameNAT INST OF ADV IND SCIENCE AN·Filed 2006·Application pending·0 cites
- 1140US5034569AMultilayer interconnection circuit boardMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jul 23, 1991·9 cites·6 claims
- 1240US4946709AMethod for fabricating hybrid integrated circuitMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Aug 7, 1990·9 cites·8 claims
- 1334US5175399AWiring panel including wiring having a surface-reforming layer and method for producing the sameMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 29, 1992·8 cites·16 claims
- 1432US5069745AProcess for preparing a combined wiring substrateMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Dec 3, 1991·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →