Inventor · disambiguated record
Eiji Hagimoto
Also filed as: HAGIMOTO EIJI
4 granted patents·232 citations·filing 1995–1998
81Inventor score
Technology areasH10W
Files withNEC CORP4
Top patents by PatentIndex Score
4 records- 0192US5683942AMethod for manufacturing bump leaded film carrier type semiconductor deviceNEC CORP·Filed 1995·Granted Nov 4, 1997·133 cites·52 claims
- 0285US5905303AMethod for manufacturing bump leaded film carrier type semiconductor deviceNEC CORP·Filed 1997·Granted May 18, 1999·77 cites·23 claims
- 0350US5909055AChip package device mountable on a mother board in whichever of facedown and wire bonding mannersNEC CORP·Filed 1998·Granted Jun 1, 1999·14 cites·3 claims
- 0440US5969417AChip package device mountable on a mother board in whichever of facedown and wire bonding mannersNEC CORP·Filed 1997·Granted Oct 19, 1999·8 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →