Inventor · disambiguated record
Eiji Harada
Also filed as: HARADA EIJI
9 granted patents·3 pending applications·119 citations·filing 1988–2025
85Inventor score
Files withRENESAS ELECTRONICS CORP3HITACHI LTD2NAKAHIGASHI SEIJI2DAIKYONISHIKAWA CORP1MITSUBISHI ELECTRIC CORP1
Top patents by PatentIndex Score
12 records- 0178US5870306AAutomatic programming method and device for multi-system machine toolMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Feb 9, 1999·79 cites·12 claims
- 0257US12140060B2Exhaust gas purification systemSUGIURA KOJI·Filed 2023·Granted Nov 12, 2024·0 cites·3 claims
- 0357US7350858B2Vehicular back trimDAIKYONISHIKAWA CORP·Filed 2005·Granted Apr 1, 2008·3 cites·11 claims
- 0454US7934136B2Test apparatus, pattern generator, test method and pattern generating methodRENESAS ELECTRONICS CORP·Filed 2008·Granted Apr 26, 2011·2 cites·20 claims
- 0554US2025387783A1Exhaust gas purification deviceNAKAHIGASHI SEIJI·Filed 2025·Application pending·0 cites
- 0645US6044214AFault simulation method operable at a high speedNEC CORP·Filed 1998·Granted Mar 28, 2000·24 cites·14 claims
- 0744US2025073640A1Exhaust gas purification deviceNAKAHIGASHI SEIJI·Filed 2024·Application pending·0 cites
- 0843US7360492B2Railway car with overload detectorHITACHI LTD·Filed 2005·Granted Apr 22, 2008·0 cites·4 claims
- 0940US7873887B2Burn-in test circuit, burn-in test method, burn-in test apparatus, and a burn-in test pattern generation program productRENESAS ELECTRONICS CORP·Filed 2007·Granted Jan 18, 2011·0 cites·14 claims
- 1038US4884126ASemiconductor device having parallel-connected, self turn-off type semiconductor elementsHITACHI LTD·Filed 1988·Granted Nov 28, 1989·11 cites·4 claims
- 1137US7511506B2Semiconductor testing system and testing methodNEC ELECTRONICS CORP·Filed 2007·Granted Mar 31, 2009·0 cites·4 claims
- 1235US2011126063A1Method for inserting test points for logic circuits and logic circuit testing apparatusRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →