Inventor · disambiguated record
Eiji Hasunuma
Also filed as: HASUNUMA EIJI
17 granted patents·11 pending applications·53 citations·filing 1999–2019
91Inventor score
Files withELPIDA MEMORY INC10HASUNUMA EIJI4MICRON TECHNOLOGY INC4RENESAS TECH CORP4MITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
28 records- 0192US8847353B2Semiconductor device and data processing system using the sameHASUNUMA EIJI·Filed 2011·Granted Sep 30, 2014·23 cites·27 claims
- 0278US8378499B2Semiconductor storage deviceELPIDA MEMORY INC·Filed 2011·Granted Feb 19, 2013·4 cites·22 claims
- 0377US8093724B2Semiconductor storage deviceHASUNUMA EIJI·Filed 2007·Granted Jan 10, 2012·6 cites·24 claims
- 0475US10153027B1Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 11, 2018·1 cites·12 claims
- 0575US10083734B1Memory arraysMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 25, 2018·1 cites·14 claims
- 0669US7723184B2Semiconductor device and manufacture method thereforELPIDA MEMORY INC·Filed 2007·Granted May 25, 2010·4 cites·8 claims
- 0767US10242726B1Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 26, 2019·1 cites·22 claims
- 0865US6504192B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jan 7, 2003·10 cites·9 claims
- 0963US9147686B2Method for forming semiconductor deviceSAKO NOBUYUKI·Filed 2011·Granted Sep 29, 2015·2 cites·5 claims
- 1058US8786000B2Semiconductor device suppressing peeling of lower electrode of capacitorHASUNUMA EIJI·Filed 2011·Granted Jul 22, 2014·1 cites·10 claims
- 1154US11004494B2Memory arrays, and methods of forming memory arraysMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·0 cites·15 claims
- 1253USRE47240ESemiconductor storage devicePS4 LUXCO SARL·Filed 2014·Granted Feb 12, 2019·0 cites·26 claims
- 1351US2009130848A1Semiconductor device and method for production thereofELPIDA MEMORY INC·Filed 2009·Application pending·0 cites
- 1447US2007090472A1Semiconductor device and method for production thereofELPIDA MEMORY INC·Filed 2006·Application pending·0 cites
- 1545US2007296053A1Semiconductor device and method of forming the sameELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 1644US2008217790A1Semiconductor device and manufacturing method thereofELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 1743US2004232512A1Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1842US2007145486A1Semiconductor memory device and method of manufacturing the sameELPIDA MEMORY INC·Filed 2006·Application pending·0 cites
- 1940US2008012059A1Semiconductor device and manufacturing method thereofELPIDA MEMORY INC·Filed 2007·Application pending·0 cites
- 2038US6815318B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2003·Granted Nov 9, 2004·0 cites·5 claims
- 2138US2015333117A1Semiconductor device and manufacturing method thereofSAKO NOBUYUKI·Filed 2013·Application pending·0 cites
- 2237US8105907B2Manufacturing method of semiconductor memory deviceHASUNUMA EIJI·Filed 2010·Granted Jan 31, 2012·0 cites·14 claims
- 2335US2003015796A1Semiconductor device and production method thereofMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2435US2007002601A1Semiconductor memory deviceELPIDA MEMORY INC·Filed 2006·Application pending·0 cites
- 2534US6710392B2Semiconductor memory device with increased capacitance and reduced performance fluctuationRENESAS TECH CORP·Filed 2002·Granted Mar 23, 2004·0 cites·15 claims
- 2634US2011189828A1Method for forming silicon layer and method for manufacturing semiconductor deviceELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 2733US6596582B2Method of manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Jul 22, 2003·0 cites·3 claims
- 2830US6765251B2Semiconductor device having interconnection structureRENESAS TECH CORP·Filed 1999·Granted Jul 20, 2004·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →