Inventor · disambiguated record
Eiji Higurashi
Also filed as: HIGURASHI EIJI
1 granted patent·2 pending applications·0 citations·filing 2022–2022
2Inventor score
Files withAIST3
Top patents by PatentIndex Score
3 records- 0148US2024258195A1Bonded body comprising mosaic diamond wafer and semiconductor of different type, method for producing same, and mosaic diamond wafer for use in bonded body with semiconductor of different typeAIST·Filed 2022·Application pending·0 cites
- 0246US2024149565A1Composite body comprising silicon carbide and method for producing sameAIST·Filed 2022·Application pending·0 cites
- 0344US12389520B2Plasma source, and atomic clock employing plasma sourceAIST·Filed 2022·Granted Aug 12, 2025·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →