Inventor · disambiguated record
Eiji Hiraiwa
Also filed as: HIRAIWA EIJI
0 granted patents·4 pending applications·0 citations·filing 2023–2024
Files withRENESAS ELECTRONICS CORP4
Top patents by PatentIndex Score
4 records- 0164US2025192025A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0259US2024162137A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 0358US2024306382A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0458US2023352397A1Semiconductor device and method of manufacturing the semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →