Inventor · disambiguated record
Eiji Horikoshi
Also filed as: HORIKOSHI EIJI
7 granted patents·119 citations·filing 1988–1996
87Inventor score
Files withFUJITSU LTD7
Top patents by PatentIndex Score
7 records- 0171US5972807APhotosensitive, heat-resistant resin composition and process for using same to form patterns as well as polymeric composite and production process thereofFUJITSU LTD·Filed 1996·Granted Oct 26, 1999·31 cites·5 claims
- 0268US4941918ASintered magnesium-based composite material and process for preparing sameFUJITSU LTD·Filed 1988·Granted Jul 17, 1990·17 cites·20 claims
- 0355US5308929AVia hole structure and process for formation thereofFUJITSU LTD·Filed 1992·Granted May 3, 1994·26 cites·18 claims
- 0453US5362359ACircuit board and process for producing sameFUJITSU LTD·Filed 1993·Granted Nov 8, 1994·14 cites·19 claims
- 0550US6045975APhotosensitive, heat-resistant resin composition for forming patternsFUJITSU LTD·Filed 1993·Granted Apr 4, 2000·13 cites·2 claims
- 0650US6013419AProcess for using photosensitive, heat-resistant resin composition to form patternsFUJITSU LTD·Filed 1995·Granted Jan 11, 2000·11 cites·3 claims
- 0741US5236772ACircuit board and process for producing sameFUJITSU LTD·Filed 1991·Granted Aug 17, 1993·7 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →