Inventor · disambiguated record
Eiichirou Kishida
Also filed as: KISHIDA Eiichirou
7 granted patents·2 pending applications·4 citations·filing 2016–2022
75Inventor score
Top patents by PatentIndex Score
9 records- 0186US10950515B2Semiconductor device, manufacturing method of semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Mar 16, 2021·2 cites·4 claims
- 0277US12014968B2Semiconductor device, manufacturing method of semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 0376US10636714B2Semiconductor device, manufacturing method of semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Apr 28, 2020·2 cites·7 claims
- 0470US11527453B2Semiconductor device, manufacturing method of semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 0551US2024290805A1Solid-state imaging device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 0650US2024170512A1Semiconductor package and method for manufacturing semiconductor packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 0744US10720459B2Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficientsSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Jul 21, 2020·0 cites·12 claims
- 0838US10506186B2Solid-state imaging device and solid-state imaging apparatusSONY CORP·Filed 2016·Granted Dec 10, 2019·0 cites·7 claims
- 0931US11171170B2Image sensor package with flexible printed circuitsSONY CORP·Filed 2016·Granted Nov 9, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →