Inventor · disambiguated record
Eiji Kurose
Also filed as: KUROSE EIJI
28 granted patents·9 pending applications·12 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
37 records- 0191US12469709B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 0291US2025349550A1Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0391US2025349549A1Semiconductor devices having die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0489US11404276B2Semiconductor packages with thin die and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·2 cites·6 claims
- 0588US12374555B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0687US11562981B2Methods of forming semiconductor packages with back side metalSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Jan 24, 2023·1 cites·20 claims
- 0785US12374554B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0885US11342189B2Semiconductor packages with die including cavities and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 24, 2022·1 cites·20 claims
- 0985US2025293032A1Multi-faced molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1080US10943886B2Methods of forming semiconductor packages with back side metalSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 9, 2021·2 cites·21 claims
- 1180US10529576B2Multi-faced molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 7, 2020·2 cites·19 claims
- 1279US12040192B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1378US12040310B2Methods of forming semiconductor packages with back side metalSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 1477US11908699B2Semiconductor packages with die including cavitiesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 1576US12444609B2Silicon-on-insulator die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 14, 2025·0 cites·11 claims
- 1676US12431359B2Semiconductor package electrical contacts and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Sep 30, 2025·0 cites·5 claims
- 1776US12341014B2Multi-faced molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1873US2025232978A1Semiconductor package stress balance structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 1973US2025232979A1Semiconductor package stress balance structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 2072US11894234B2Semiconductor packages with die support structure for thin dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 6, 2024·0 cites·18 claims
- 2172US11404277B2Die sidewall coatings and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 2, 2022·0 cites·7 claims
- 2271US11901184B2Backmetal removal methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2371US11791297B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 17, 2023·0 cites·18 claims
- 2471US2024006363A1Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 2570US12230502B2Semiconductor package stress balance structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Feb 18, 2025·0 cites·12 claims
- 2669US11361970B2Silicon-on-insulator die support structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 14, 2022·0 cites·10 claims
- 2768US11393692B2Semiconductor package electrical contact structures and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jul 19, 2022·0 cites·16 claims
- 2868US11367619B2Semiconductor package electrical contacts and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jun 21, 2022·0 cites·11 claims
- 2966US8728876B2Method of manufacturing semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted May 20, 2014·2 cites·20 claims
- 3065US11348796B2Backmetal removal methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 3164US11328930B2Multi-faced molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 10, 2022·0 cites·20 claims
- 3261US8809076B2Semiconductor device and method of automatically inspecting an appearance of the sameSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Aug 19, 2014·1 cites·19 claims
- 3357US2024379603A1Structure and method for power metal linesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 3453US11244918B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 8, 2022·0 cites·16 claims
- 3551US11018030B2Fan-out wafer level chip-scale packages and methods of manufactureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 3647US2020258750A1Die support structures and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2020·Application pending·0 cites
- 3735US2017352582A1Process of forming an electronic device including a bond padSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →