Inventor · disambiguated record
Eitaro Miyake
Also filed as: MIYAKE EITARO
15 granted patents·10 pending applications·37 citations·filing 2001–2025
88Inventor score
Top patents by PatentIndex Score
25 records- 0194US11202381B2Connection deviceTOSHIBA KK·Filed 2020·Granted Dec 14, 2021·6 cites·9 claims
- 0270US11570918B2Connection deviceTOSHIBA KK·Filed 2021·Granted Jan 31, 2023·0 cites·10 claims
- 0360US8896113B2Base plate and semiconductor deviceMIYAKE EITARO·Filed 2012·Granted Nov 25, 2014·2 cites·15 claims
- 0460US7332804B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Granted Feb 19, 2008·4 cites·9 claims
- 0559US9006881B2Semiconductor deviceTOSHIBA KK·Filed 2013·Granted Apr 14, 2015·1 cites·15 claims
- 0659US2025357411A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0757US6548890B2Press-contact type semiconductor deviceTOSHIBA KK·Filed 2002·Granted Apr 15, 2003·9 cites·20 claims
- 0857US2025266409A1IsolatorTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0956US2025038057A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1056US2025040053A1Semiconductor deviceTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1155US6605870B2Pressure-contact type semiconductor deviceTOSHIBA KK·Filed 2001·Granted Aug 12, 2003·8 cites·39 claims
- 1254US8952508B2Lead frame, semiconductor manufacturing apparatus, and semiconductor deviceMIYAKE EITARO·Filed 2012·Granted Feb 10, 2015·1 cites·18 claims
- 1352US6759735B2High power semiconductor device having semiconductor chipsTOSHIBA KK·Filed 2003·Granted Jul 6, 2004·6 cites·22 claims
- 1450US2025267956A1Semiconductor deviceTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1546US10855196B2Semiconductor deviceTOSHIBA KK·Filed 2019·Granted Dec 1, 2020·0 cites·14 claims
- 1642US9147621B2Semiconductor device component and semiconductor deviceTOSHIBA KK·Filed 2014·Granted Sep 29, 2015·0 cites·17 claims
- 1740US11257920B2Fastening member and semiconductor deviceTOSHIBA KK·Filed 2019·Granted Feb 22, 2022·0 cites·17 claims
- 1840US10896867B2Terminal plate and semiconductor deviceTOSHIBA KK·Filed 2019·Granted Jan 19, 2021·0 cites·4 claims
- 1940US2015206811A1Semiconductor deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2035US2015075842A1Semiconductor device component, semiconductor device, and semiconductor device terminalTOSHIBA KK·Filed 2014·Application pending·0 cites
- 2132US9343384B2Semiconductor deviceTOSHIBA KK·Filed 2015·Granted May 17, 2016·0 cites·18 claims
- 2232US2012241934A1Semiconductor apparatus and method for manufacturing the sameMIYAKE EITARO·Filed 2012·Application pending·0 cites
- 2332US2012243281A1Power semiconductor deviceMIYAKE EITARO·Filed 2012·Application pending·0 cites
- 2431US10217690B2Semiconductor module that have multiple paths for heat dissipationTOSHIBA KK·Filed 2016·Granted Feb 26, 2019·0 cites·18 claims
- 2529US2016111554A1Semiconductor deviceTOSHIBA KK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →