Inventor · disambiguated record
Eiji Mugiya
Also filed as: MUGIYA EIJI
12 granted patents·7 pending applications·133 citations·filing 2006–2015
90Inventor score
Top patents by PatentIndex Score
19 records- 0195US8314343B2Multi-layer board incorporating electronic component and method for producing the sameINOUE YUSUKE·Filed 2008·Granted Nov 20, 2012·51 cites·8 claims
- 0293US8897019B1Circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 25, 2014·22 cites·3 claims
- 0392US9055682B2Circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Jun 9, 2015·18 cites·3 claims
- 0487US8890309B1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Nov 18, 2014·8 cites·3 claims
- 0584US9456488B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Granted Sep 27, 2016·7 cites·5 claims
- 0682US9101050B2Circuit module having electrical shieldTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·1 claims
- 0782US9101044B2Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Granted Aug 4, 2015·6 cites·11 claims
- 0880US8536959B1Substrate with built-in electronic componentMUGIYA EIJI·Filed 2012·Granted Sep 17, 2013·7 cites·8 claims
- 0978US9807916B2Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Granted Oct 31, 2017·5 cites·7 claims
- 1072US9455209B2Circuit module and production method thereforTAIYO YUDEN KK·Filed 2014·Granted Sep 27, 2016·3 cites·9 claims
- 1154US9018039B2Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2014·Granted Apr 28, 2015·0 cites·2 claims
- 1249US2006186519A1Semiconductor device and unit equipped with the sameINOUE TAIZO·Filed 2006·Application pending·0 cites
- 1343US2015062835A1Circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1443US2015043172A1Circuit module and method of producing circuit moduleTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1543US2015016066A1Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2014·Application pending·0 cites
- 1642US2015043189A1Circuit module and method of producing the sameTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1741US2013271928A1Circuit module and method of manufacturing the sameTAIYO YUDEN KK·Filed 2013·Application pending·0 cites
- 1840US2014049928A1Substrate with built-in electronic componentSAWATARI TATSURO·Filed 2012·Application pending·0 cites
- 1938US9560740B2Circuit module and method of manufacturing sameTAIYO YUDEN KK·Filed 2015·Granted Jan 31, 2017·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →