Inventor · disambiguated record
Eiichi Nakano
Also filed as: NAKANO EIICHI
69 granted patents·17 pending applications·783 citations·filing 1976–2025
99Inventor score
Files withMICRON TECHNOLOGY INC46SANDO IRON WORKS CO13KIKKOMAN CORP9NODA INST FOR SCIENTIFIC RES5AJINOMOTO KK2
Top patents by PatentIndex Score
86 records- 0199US10319696B1Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packagesMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 11, 2019·40 cites·18 claims
- 0297US10141259B1Semiconductor devices having electrically and optically conductive vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Nov 27, 2018·16 cites·28 claims
- 0396US10217726B1Stacked semiconductor dies including inductors and associated methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 26, 2019·15 cites·18 claims
- 0494US10854549B2Redistribution layers with carbon-based conductive elements, methods of fabrication and related semiconductor device packages and systemsMICRON TECHNOLOGY INC·Filed 2018·Granted Dec 1, 2020·7 cites·22 claims
- 0594US5219737AMutant luciferase of a firefly, mutant luciferase genes, recombinant dnas containing the genes and a method of producing mutant luciferaseKIKKOMAN CORP·Filed 1991·Granted Jun 15, 1993·80 cites·15 claims
- 0693US10651050B2Semiconductor device packages and structuresMICRON TECHNOLOGY INC·Filed 2019·Granted May 12, 2020·7 cites·14 claims
- 0790US4968613ALuciferase gene and novel recombinant DNA as well as a method of producing luciferaseKIKKOMAN CORP·Filed 1988·Granted Nov 6, 1990·49 cites·10 claims
- 0889US5229285AThermostable luciferase of firefly, thermostable luciferase gene of firefly, novel recombinant dna, and process for the preparation of thermostable luciferase of fireflyKIKKOMAN CORP·Filed 1992·Granted Jul 20, 1993·127 cites·5 claims
- 0988US11791315B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 17, 2023·1 cites·20 claims
- 1088US11171118B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·4 cites·21 claims
- 1188US5407446AMethod and apparatus for the pretreatment of a clothSANDO IRON WORKS CO·Filed 1993·Granted Apr 18, 1995·38 cites·1 claims
- 1285US6090597AMethod of producing L-lysineAJINOMOTO KK·Filed 1997·Granted Jul 18, 2000·36 cites·8 claims
- 1384US10446527B2Stacked semiconductor dies including inductors and associated methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 15, 2019·3 cites·18 claims
- 1484US2025279368A1Redistribution layers with carbon-based conductive elements, and related microelectronic device pacakages and methods of fabricationLODESTAR LICENSING GROUP LLC·Filed 2025·Application pending·0 cites
- 1583US12362311B2Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methodsMICRON TECHNOLOGY INC·Filed 2024·Granted Jul 15, 2025·0 cites·21 claims
- 1683US5330906AMutant luciferase of a fireflyKIKKOMAN CORP·Filed 1993·Granted Jul 19, 1994·66 cites·5 claims
- 1783US4348477AMethod for preparing a recombinant DNA phageNODA INST FOR SCIENTIFIC RES·Filed 1979·Granted Sep 7, 1982·32 cites·11 claims
- 1882US12300622B2Device packages including redistribution layers with carbon-based conductive elements, and methods of fabricationLODESTAR LICENSING GROUP LLC·Filed 2023·Granted May 13, 2025·0 cites·19 claims
- 1981US10529659B2Semiconductor devices having electrically and optically conductive vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 7, 2020·2 cites·20 claims
- 2081US4332897ANovel bacteriophage and method for preparing sameNODA INST FOR SCIENTIFIC RES·Filed 1978·Granted Jun 1, 1982·28 cites·17 claims
- 2180US4348478AMethod for preparation of a recombinant DNA phageNODA INST FOR SCIENTIFIC RES·Filed 1979·Granted Sep 7, 1982·27 cites·13 claims
- 2280US2024387441A1Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 2378US12237299B2Systems and methods for direct bonding in semiconductor die manufacturingMICRON TECHNOLOGY INC·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 2478US5182202APurified luciferase from luciola cruciataKIKKOMAN CORP·Filed 1991·Granted Jan 26, 1993·58 cites·1 claims
- 2575US11069612B2Semiconductor devices having electrically and optically conductive vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 20, 2021·1 cites·21 claims
- 2674US11881468B2Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 23, 2024·0 cites·26 claims
- 2773US12051670B2Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 2873US11380665B2Semiconductor dice assemblies, packages and systems, and methods of operationMICRON TECHNOLOGY INC·Filed 2019·Granted Jul 5, 2022·1 cites·21 claims
- 2972US10600770B2Semiconductor dice assemblies, packages and systems, and methods of operationMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·1 cites·13 claims
- 3071US11749608B2Device packages including redistribution layers with carbon-based conductive elements, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 5, 2023·0 cites·20 claims
- 3171US11410973B2Microelectronic device assemblies and packages and related methods and systemsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·24 claims
- 3271US2025182839A1Memory with parallel main and test interfacesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3369US12437832B2Repair techniques for coupled memory diesMICRON TECHNOLOGY INC·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 3469US11456278B2Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packagesMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·0 cites·22 claims
- 3568US2025385205A1Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3667US11817420B2Systems and methods for direct bonding in semiconductor die manufacturingMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 3766US5352598APurified luciferase from luciola lateralisKIKKOMAN CORP·Filed 1991·Granted Oct 4, 1994·29 cites·1 claims
- 3865US12278202B2Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methodsMICRON TECHNOLOGY INC·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 3964US12243610B2Memory with parallel main and test interfacesMICRON TECHNOLOGY INC·Filed 2022·Granted Mar 4, 2025·0 cites·12 claims
- 4064US2025140753A1Stacked semiconductor device with semiconductor dies of variable sizeMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4162US2025233044A1Memory device with enhanced thermal conductivityMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4261US11189588B2Anisotropic conductive film with carbon-based conductive regions and related semiconductor assemblies, systems, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 30, 2021·0 cites·34 claims
- 4361US10797018B2Methods for fabricating 3D semiconductor device packages, resulting packages and systems incorporating such packagesMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 6, 2020·0 cites·17 claims
- 4461US2024313098A1Transistor architectures in coupled semiconductor systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4560US12199068B2Methods of forming microelectronic device assemblies and packagesMICRON TECHNOLOGY INC·Filed 2022·Granted Jan 14, 2025·0 cites·8 claims
- 4660US11915997B2Thermal management of GPU-HBM package by microchannel integrated substrateMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 27, 2024·0 cites·10 claims
- 4760US11139262B2Use of pre-channeled materials for anisotropic conductorsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·0 cites·19 claims
- 4860US2024237363A1Techniques for modular die configurations for multi-channel memoryMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 4959US2024186274A1Techniques for thermal distribution in coupled semiconductor systemsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 5058US7846698B2Method of producing L-lysineAJINOMOTO KK·Filed 2002·Granted Dec 7, 2010·0 cites·12 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →