Inventor · disambiguated record
Eiichi Ogawa
Also filed as: OGAWA EIICHI
9 granted patents·116 citations·filing 1984–2002
87Inventor score
Top patents by PatentIndex Score
9 records- 0177US5545281AMethod of bonding circuit boardsNEC CORP·Filed 1994·Granted Aug 13, 1996·50 cites·11 claims
- 0275US5318651AMethod of bonding circuit boardsNEC CORP·Filed 1992·Granted Jun 7, 1994·46 cites·1 claims
- 0368US6485551B1Method of printing a polyamide structure, such a method based on an inkjet system and an inkset for such a systemSEIREN CO LTD·Filed 2000·Granted Nov 26, 2002·5 cites·19 claims
- 0446US6653454B1Formazane compounds and method of dyeing using the sameNIPPON KAYAKU KK·Filed 2000·Granted Nov 25, 2003·1 cites·6 claims
- 0540US7029503B2Disazo compound, reactive dye composition, and method of dyeing cellulose or cellulose-containing fibersNIPPON KAYAKU KK·Filed 2002·Granted Apr 18, 2006·5 cites·8 claims
- 0631US4667021AChromium complex compoundNIPPON KAYAKU KK·Filed 1984·Granted May 19, 1987·1 cites·3 claims
- 0726US5942011AProcess for dyeing textiles containing polyester fibers and dyeing auxiliariesNIPPON KAYAKU KK·Filed 1997·Granted Aug 24, 1999·4 cites·6 claims
- 0826US5032140AAqueous liquid composition of naphthalene sulfonate reactive dye with at least one lithium or tri-ethanol ammonium cationNIPPON KAYAKU KK·Filed 1989·Granted Jul 16, 1991·3 cites·5 claims
- 0925US6086640AFormazan compounds and method of dyeing therewithNIPPON KAYAKU KK·Filed 1998·Granted Jul 11, 2000·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →