Inventor · disambiguated record
Eiichiro Saito
Also filed as: SAITO EIICHIRO
13 granted patents·4 pending applications·54 citations·filing 1989–2023
87Inventor score
Files withPANASONIC IP MAN CO LTD10MATSUSHITA ELECTRIC WORKS LTD5PANASONIC CORP1PANASONIC ELEC WORKS CO LTD1
Top patents by PatentIndex Score
17 records- 0184US7838576B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetPANASONIC ELEC WORKS CO LTD·Filed 2008·Granted Nov 23, 2010·6 cites·19 claims
- 0280US7413791B2Poly (phenylene ether) resin composition, prepreg, and laminated sheetMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Aug 19, 2008·15 cites·19 claims
- 0374US11617261B2Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Granted Mar 28, 2023·2 cites·15 claims
- 0470US5312651AMethod for making a prepreg of an epoxy resin impregnated fiberglass substrateMATSUSHITA ELECTRIC WORKS LTD·Filed 1992·Granted May 17, 1994·22 cites·6 claims
- 0570US2025215148A1Resin composition for optical waveguides, dry film for optical waveguides, and optical waveguidePANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 0664US12441856B2Resin sheet, prepreg, insulating resin member, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·6 claims
- 0764US11814502B2Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 0864US6589656B2Epoxy resin composition, prepreg and metal-clad laminateMATSUSHITA ELECTRIC WORKS LTD·Filed 2001·Granted Jul 8, 2003·6 cites·13 claims
- 0961US12006433B2Thermosetting resin composition, resin sheet, laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Granted Jun 11, 2024·0 cites·11 claims
- 1061US2023151204A1Resin composition, resin film member, printed wiring board, and method for manufacturing the printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Application pending·0 cites
- 1161US2025136741A1Thermosetting resin composition, resin sheet, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 1250US12404399B2Thermosetting resin sheet and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·12 claims
- 1346US5112989AProcess for producing unsaturated mono and dicarboxylic acid imide compoundMATSUSHITA ELECTRIC WORKS LTD·Filed 1989·Granted May 12, 1992·3 cites·12 claims
- 1445US10791633B2Thick conductor built-in type printed wiring board and method for producing samePANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 29, 2020·0 cites·6 claims
- 1540US2014243493A1(meth) acrylate resin composition and cured product of samePANASONIC CORP·Filed 2013·Application pending·0 cites
- 1634US11114354B2Printed wiring board, printed circuit board, prepregPANASONIC IP MAN CO LTD·Filed 2017·Granted Sep 7, 2021·0 cites·8 claims
- 1726US5136015AAddition type imide resin prepolymer, manufacturing method thereof, prepreg and laminate thereofMATSUSHITA ELECTRIC WORKS LTD·Filed 1990·Granted Aug 4, 1992·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →