Inventor · disambiguated record
Eisuke Shiga
Also filed as: SHIGA EISUKE
20 granted patents·3 pending applications·71 citations·filing 2013–2021
92Inventor score
Top patents by PatentIndex Score
23 records- 0194USD964388SDisplay screen or portion thereof with graphical user interfaceAUDIO TECHNICA KK·Filed 2021·Granted Sep 20, 2022·22 cites·1 claims
- 0292USD965009SDisplay screen or portion thereof with graphical user interfaceAUDIO TECHNICA KK·Filed 2021·Granted Sep 27, 2022·17 cites·1 claims
- 0391US11195638B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2020·Granted Dec 7, 2021·2 cites·16 claims
- 0488USD965008SDisplay screen or portion thereof with graphical user interfaceAUDIO TECHNICA KK·Filed 2021·Granted Sep 27, 2022·12 cites·1 claims
- 0587US10676579B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jun 9, 2020·3 cites·16 claims
- 0683US9902851B2Resin composition, prepreg, laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Feb 27, 2018·4 cites·38 claims
- 0781US10030141B2Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Jul 24, 2018·2 cites·38 claims
- 0879USD964389SDisplay screen or portion thereof with graphical user interfaceAUDIO TECHNICA KK·Filed 2021·Granted Sep 20, 2022·7 cites·1 claims
- 0976US11769607B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2021·Granted Sep 26, 2023·0 cites·13 claims
- 1070US10550228B2Resin composition, prepreg, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 4, 2020·1 cites·25 claims
- 1163US10178767B2Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2013·Granted Jan 8, 2019·0 cites·38 claims
- 1263US2018197655A1Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
- 1362US10703874B2Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising themMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 7, 2020·1 cites·13 claims
- 1456US10791626B2Prepreg, metal foil-clad laminate, and printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Sep 29, 2020·0 cites·17 claims
- 1549US2020325292A1Resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2018·Application pending·0 cites
- 1648US10292260B2Insulating layer for printed circuit board and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2015·Granted May 14, 2019·0 cites·18 claims
- 1747US10138393B2Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring boardMITSUBISHI GAS CHEMICAL CO·Filed 2014·Granted Nov 27, 2018·0 cites·23 claims
- 1846US10721817B2Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising themMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 21, 2020·0 cites·10 claims
- 1945US10717837B2Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising sameMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Jul 21, 2020·0 cites·15 claims
- 2045US10563029B2Resin composition and prepreg, resin sheet, laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 2144US10869390B2Resin composition, prepreg, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Dec 15, 2020·0 cites·12 claims
- 2243US10815349B2Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit boardMITSUBISHI GAS CHEMICAL CO·Filed 2016·Granted Oct 27, 2020·0 cites·16 claims
- 2338US2018163048A1Method for producing printed circuit board, and resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →