Inventor · disambiguated record
Eiji Takano
Also filed as: TAKANO EIJI
21 granted patents·2 pending applications·246 citations·filing 1982–2022
94Inventor score
Top patents by PatentIndex Score
23 records- 0184US8975160B2Manufacturing method for semiconductor deviceTOSHIBA KK·Filed 2013·Granted Mar 10, 2015·6 cites·20 claims
- 0284US5392740AGas fuel engineMAZDA MOTOR·Filed 1993·Granted Feb 28, 1995·42 cites·7 claims
- 0380US6376907B1Ball grid array type package for semiconductor deviceTOSHIBA KK·Filed 1998·Granted Apr 23, 2002·60 cites·26 claims
- 0476US4501691AProcess for treating a radioactive liquid wasteMITSUBISHI METAL CORP·Filed 1982·Granted Feb 26, 1985·23 cites·1 claims
- 0575US6214156B1Semiconductor device mounted on board by flip-chip and method for mounting the sameTOSHIBA KK·Filed 1999·Granted Apr 10, 2001·39 cites·5 claims
- 0671US8704337B2Semiconductor device and method for manufacturing the sameTAKANO EIJI·Filed 2010·Granted Apr 22, 2014·3 cites·13 claims
- 0769US5271359AGas fuel engineMAZDA MOTOR·Filed 1991·Granted Dec 21, 1993·25 cites·24 claims
- 0865US10546769B2Semiconductor manufacturing method and semiconductor manufacturing deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Jan 28, 2020·1 cites·17 claims
- 0959US4505882AProcess for manufacturing uranium dioxide powderMITSUBISHI NUCLEAR FUEL·Filed 1983·Granted Mar 19, 1985·12 cites·4 claims
- 1058US5351656AFuel supply apparatusMAZDA MOTOR·Filed 1994·Granted Oct 4, 1994·18 cites·19 claims
- 1156US12341024B2Method for manufacturing semiconductor device including resin layersKIOXIA CORP·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 1256US10741505B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Aug 11, 2020·0 cites·20 claims
- 1355US5952727AFlip-chip interconnection having enhanced electrical connectionsTOSHIBA KK·Filed 1997·Granted Sep 14, 1999·17 cites·7 claims
- 1453US10211165B2Method of manufacturing semiconductor device and semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Feb 19, 2019·0 cites·14 claims
- 1552US10900411B2Engine with supercharger arrangementMAZDA MOTOR·Filed 2017·Granted Jan 26, 2021·0 cites·6 claims
- 1650US7993974B2Method for manufacturing a semiconductor deviceTOSHIBA KK·Filed 2008·Granted Aug 9, 2011·0 cites·10 claims
- 1748US9997390B2Semiconductor manufacturing method and laminated bodyTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 12, 2018·0 cites·19 claims
- 1848US2010213564A1Sensor chip and method of manufacturing the sameTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1944US10804152B2Method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 13, 2020·0 cites·7 claims
- 2041US10818501B2Method for manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
- 2141US2016326948A1Intake air cooling device of internal combustion engineMAZDA MOTOR·Filed 2016·Application pending·0 cites
- 2240US8809242B2Lubricant member and method of manufacturing the sameTAKANO EIJI·Filed 2011·Granted Aug 19, 2014·0 cites·7 claims
- 2338US8338918B2Method for manufacturing a semiconductor device, method for detecting a semiconductor substrate and semiconductor chip packageSEKIGUCHI MASAHIRO·Filed 2011·Granted Dec 25, 2012·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →