Inventor · disambiguated record
Eigo Tange
Also filed as: TANGE EIGO
12 granted patents·1 pending application·121 citations·filing 2004–2018
89Inventor score
Top patents by PatentIndex Score
13 records- 0194US7269392B2Electric component for communication device and semiconductor device for switching transmission and receptionRENESAS TECH CORP·Filed 2004·Granted Sep 11, 2007·69 cites·2 claims
- 0283US7312482B2Semiconductor device, power amplifier device and PC cardRENESAS TECH CORP·Filed 2006·Granted Dec 25, 2007·12 cites·11 claims
- 0382US7437129B2Electric component for communication device and semiconductor device for switching transmission and receptionRENESAS TECH CORP·Filed 2007·Granted Oct 14, 2008·10 cites·8 claims
- 0479US7307298B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 11, 2007·20 cites·21 claims
- 0566US7425876B2Antenna switch circuit and high frequency module having the sameRENESAS TECH CORP·Filed 2005·Granted Sep 16, 2008·3 cites·10 claims
- 0665US9444512B2Semiconductor device and high-frequency moduleMURATA MANUFACTURING CO·Filed 2012·Granted Sep 13, 2016·2 cites·11 claims
- 0762US9413415B2High frequency moduleMURATA MANUFACTURING CO·Filed 2012·Granted Aug 9, 2016·1 cites·14 claims
- 0861US7995972B2Electronic component for communication device and semiconductor device for switching transmission and receptionRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·3 cites·5 claims
- 0959US7838914B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2007·Granted Nov 23, 2010·1 cites·10 claims
- 1048US10009059B2High frequency moduleMURATA MANUFACTURING CO·Filed 2016·Granted Jun 26, 2018·0 cites·5 claims
- 1141US8169008B2Semiconductor deviceYAMANE MASAO·Filed 2010·Granted May 1, 2012·0 cites·15 claims
- 1240US10438731B2Inductor and power amplifier moduleMURATA MANUFACTURING CO·Filed 2018·Granted Oct 8, 2019·0 cites·16 claims
- 1338US2004164407A1Semiconductor device, power amplifier device and PC cardFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →