Inventor · disambiguated record
Eiki Togashi
Also filed as: TOGASHI EIKI
4 granted patents·1 pending application·53 citations·filing 1988–2001
76Inventor score
Top patents by PatentIndex Score
5 records- 0176US5064881AEpoxy resin composition and semiconductor sealing material comprising same based on spherical silicaMITSUI PETROCHEMICAL IND·Filed 1990·Granted Nov 12, 1991·26 cites·11 claims
- 0267US4835240AEpoxy resin compositionMITSUI PETROCHEMICAL IND·Filed 1988·Granted May 30, 1989·8 cites·8 claims
- 0353US6231800B1Method for injection molding for epoxy resin moldings and an injection moldable epoxy resin compositionMITSUI CHEMICALS·Filed 1999·Granted May 15, 2001·16 cites·9 claims
- 0433US5908882AEpoxy resin compositionMITSUI CHEMICALS INC·Filed 1997·Granted Jun 1, 1999·3 cites·4 claims
- 0526US2003087992A1Epoxy resin composition and its useFiled 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Eiki Togashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →