Inventor · disambiguated record
Eiki Tsushima
Also filed as: TSUSHIMA EIKI
9 granted patents·5 pending applications·120 citations·filing 1987–2025
87Inventor score
Files withMITSUBISHI CORP4LX SEMICON CO LTD2TSUSHIMA EIKI2ADVANCED MATERIALS INTERNAT CO1MURATA MACHINERY LTD1
Top patents by PatentIndex Score
14 records- 0187US8012574B2Carbon fiber Ti-Ai composite material and method for preparation thereofMITSUBISHI CORP·Filed 2005·Granted Sep 6, 2011·6 cites·13 claims
- 0279US7951467B2Cladding material and its manufacturing method, press-forming method, and heat sink using cladding materialTSUSHIMA EIKI·Filed 2006·Granted May 31, 2011·14 cites·7 claims
- 0378US7749597B2Carbon fiber Ti-Al composite material and process for producing the sameMITSUBISHI CORP·Filed 2005·Granted Jul 6, 2010·3 cites·10 claims
- 0476US6649265B1Carbon-based metal composite material, method for preparation thereof and use thereofADVANCED MATERIALS INTERNAT CO·Filed 1999·Granted Nov 18, 2003·61 cites·17 claims
- 0576US4822587AHigh modulus pitch-based carbon fiber and method for preparing sameTOA NENRYO KOGYO KK·Filed 1987·Granted Apr 18, 1989·20 cites·19 claims
- 0673US7563502B2Fine carbon fiber-metal composite material and method for production thereofMITSUBISHI CORP·Filed 2005·Granted Jul 21, 2009·2 cites·12 claims
- 0761US9718688B2Carbon plate and composite carbon plateNIPPON STEEL & SUMIKIN MAT CO·Filed 2014·Granted Aug 1, 2017·0 cites·10 claims
- 0853US5665464ACarbon fiber-reinforced carbon composite material and process for the preparation thereofTONEN CORP·Filed 1995·Granted Sep 9, 1997·13 cites·6 claims
- 0953US2008277047A1Frp honeycomb structure and method for manufacturing the sameMURATA MACHINERY LTD·Filed 2008·Application pending·0 cites
- 1044US8242387B2Electronic component storing package and electronic apparatusYONEDA ATSUROU·Filed 2007·Granted Aug 14, 2012·1 cites·9 claims
- 1143US2025259909A1A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor moduleLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
- 1243US2025259908A1Heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor moduleLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
- 1338US2008057303A1Method for Manufacturing Carbon Fiber Reinforced Carbon Composite Material Suitable for Semiconductor Heat SinkMITSUBISHI CORP·Filed 2005·Application pending·0 cites
- 1435US2006234108A1Method for producing separator of fuel cellTSUSHIMA EIKI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →