Inventor · disambiguated record
Eiji Watanabe
Also filed as: KITAMURA TSUNEO · WATANABE EIJI
104 granted patents·20 pending applications·3,361 citations·filing 1976–2023
99Inventor score
Files withFUJITSU LTD23USUI KOKUSAI SANGYO KK13YASKAWA DENKI SEISAKUSHO KK8CHISSO CORP7MITSUBISHI ELECTRIC CORP7
Top patents by PatentIndex Score
124 records- 0198US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0296US5969424ASemiconductor device with pad structureFUJITSU LTD·Filed 1997·Granted Oct 19, 1999·258 cites·11 claims
- 0396US4045672AApparatus for tomography comprising a pin hole for forming a microbeam of x-raysJEOL LTD·Filed 1976·Granted Aug 30, 1977·83 cites·14 claims
- 0495US6344407B1Method of manufacturing solder bumps and solder joints using formic acidFUJITSU LTD·Filed 2000·Granted Feb 5, 2002·75 cites·25 claims
- 0594US6126208ACommon rail and method of manufacturing the sameUSUI KOKUSAI SANGYO KK·Filed 1998·Granted Oct 3, 2000·53 cites·7 claims
- 0694US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0793US6794273B2Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2002·Granted Sep 21, 2004·81 cites·8 claims
- 0893US6238626B1Automatic distribution apparatus and method of distributionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 29, 2001·172 cites·10 claims
- 0992US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 1092US6232147B1Method for manufacturing semiconductor device with pad structureFUJITSU LTD·Filed 1999·Granted May 15, 2001·133 cites·11 claims
- 1192US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 1291US6213095B1Common rail and method of manufacturing the sameUSUI KOKUSAI SANGYO KK·Filed 1998·Granted Apr 10, 2001·35 cites·4 claims
- 1391US5979945ACommon railUSUI KOKUSAI SANGYO KK·Filed 1997·Granted Nov 9, 1999·76 cites·11 claims
- 1489US7417326B2Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2006·Granted Aug 26, 2008·17 cites·6 claims
- 1589US5674061AScroll compression having a discharge muffler chamberMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Oct 7, 1997·40 cites·12 claims
- 1689US4628182AHot-wire TIG welding apparatusBABCOCK HITACHI KK·Filed 1985·Granted Dec 9, 1986·59 cites·7 claims
- 1788US8748544B2Medical appliance having a slidable coating layer and syringeTERUMO KABUSHIKI KAISHI·Filed 2013·Granted Jun 10, 2014·16 cites·22 claims
- 1888US6781224B2Semiconductor device and package including forming pyramid mount protruding through silicon substrateFUJITSU LTD·Filed 2002·Granted Aug 24, 2004·42 cites·12 claims
- 1988US6462415B1Semiconductor device as an object of thickness reductionFUJITSU LTD·Filed 2000·Granted Oct 8, 2002·51 cites·8 claims
- 2087US5992904ABranch pipe joint for high-pressure fluidsUSUI KOKUSAI SANGYO KK·Filed 1997·Granted Nov 30, 1999·64 cites·14 claims
- 2186US6550596B2Externally controlled fan coupling deviceUSUI KOKUSAI SANGYO KK·Filed 2001·Granted Apr 22, 2003·40 cites·8 claims
- 2285US9859185B2Semiconductor packaging structure and package having stress release structureKYOCERA INT INC·Filed 2017·Granted Jan 2, 2018·5 cites·17 claims
- 2385US6732911B2Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing systemFUJITSU LTD·Filed 2001·Granted May 11, 2004·35 cites·39 claims
- 2484US6795323B2Three-level neutral point clamping pwn inverter and neutral point voltage controllerYASKAWA DENKI SEISAKUSHO KK·Filed 2001·Granted Sep 21, 2004·50 cites·11 claims
- 2584US6566239B2Semiconductor device manufacturing method having a step of forming a post terminal on a wiring by electroless platingFUJITSU LTD·Filed 2001·Granted May 20, 2003·38 cites·6 claims
- 2683US9345837B2Gasket for syringe and syringe having gasketTERUMO CORP·Filed 2015·Granted May 24, 2016·6 cites·14 claims
- 2783US6408826B2Common rail and method of manufacturing the sameUSUI KOKUSAI SANGYO KK·Filed 1998·Granted Jun 25, 2002·54 cites·4 claims
- 2883US5657217AMulti-coupled power conversion system and control method for the sameYASKAWA DENKI SEISAKUSHO KK·Filed 1995·Granted Aug 12, 1997·92 cites·8 claims
- 2982US7669933B2Headrest mechanismTOYOTA MOTOR CO LTD·Filed 2007·Granted Mar 2, 2010·21 cites·15 claims
- 3082US6614113B2Semiconductor device and method for producing the sameFUJITSU LTD·Filed 2000·Granted Sep 2, 2003·37 cites·4 claims
- 3181US7318418B2Common rail for diesel engineUSUI KOKUSAI SANGYO KK·Filed 2006·Granted Jan 15, 2008·12 cites·14 claims
- 3281US5650126ADeodorizing lamp and method for production thereofAGENCY IND SCIENCE TECHN·Filed 1995·Granted Jul 22, 1997·32 cites·19 claims
- 3379US6299840B1Automatic testing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Oct 9, 2001·59 cites·25 claims
- 3479US4537477AScanning electron microscope with an optical microscopeJEOL LTD·Filed 1983·Granted Aug 27, 1985·43 cites·5 claims
- 3578US6279966B1Connector made of resin for connecting pipes of small diameterUSUI KOKUSAI SANGYO KK·Filed 1999·Granted Aug 28, 2001·45 cites·10 claims
- 3678US5863191AScroll compressor having a discharge muffler chamberMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Jan 26, 1999·22 cites·3 claims
- 3777US6751105B2Method for controlling pwm pulseYASAKAWA DENKI KK·Filed 2002·Granted Jun 15, 2004·40 cites·16 claims
- 3877US6472763B2Semiconductor device with bumps for padsFUJITSU LTD·Filed 2000·Granted Oct 29, 2002·26 cites·13 claims
- 3976US8243482B2Control device for matrix converterUEDA YOZO·Filed 2010·Granted Aug 14, 2012·8 cites·25 claims
- 4075US8742032B2Medical appliance having a slidable coating layer and syringeTERUMO CORP·Filed 2012·Granted Jun 3, 2014·7 cites·23 claims
- 4175US7754534B2Semiconductor device and manufacturing method thereofFUJITSU SEMICONDUCTOR LTD·Filed 2008·Granted Jul 13, 2010·5 cites·27 claims
- 4274US4801781ASemi-automatic hot wire tig welding equipmentBABCOCK HITACHI KK·Filed 1986·Granted Jan 31, 1989·31 cites·8 claims
- 4372US8865938B2Method for producing bis(aminomethyl)cyclohexanesYOSHIMURA NARITOSHI·Filed 2011·Granted Oct 21, 2014·2 cites·9 claims
- 4472US7670745B2Alkali soluble polymer and positive working photosensitive resin composition using the sameCHISSO CORP·Filed 2007·Granted Mar 2, 2010·4 cites·19 claims
- 4572US4462873AMethod of fixedly arranging an array of electroformed letters or the like on an articleWATANABE EIJI·Filed 1983·Granted Jul 31, 1984·26 cites·8 claims
- 4671US7602801B2Packet processing device and methodPANASONIC CORP·Filed 2004·Granted Oct 13, 2009·12 cites·11 claims
- 4770US8968260B2Gasket for syringe and syringe having gasketHORIUCHI AIKO·Filed 2010·Granted Mar 3, 2015·8 cites·17 claims
- 4870US6712522B2Perforated sleeve connectorOUDENSHA CO LTD·Filed 2002·Granted Mar 30, 2004·8 cites·8 claims
- 4969US7188609B2Fuel delivery pipeUSUI KOKUSAI SANGYO KK·Filed 2005·Granted Mar 13, 2007·5 cites·11 claims
- 5068US7355124B2Multilayer wiring board and its manufacturing methodFUJITSU LTD·Filed 2005·Granted Apr 8, 2008·4 cites·1 claims
Showing the top 50 of 124 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →