Inventor · disambiguated record
Ekapong Tangpattanasaeree
Also filed as: TANGPATTANASAEREE EKAPONG
1 granted patent·3 pending applications·2 citations·filing 2017–2018
19Inventor score
Files withNXP BV4
Top patents by PatentIndex Score
4 records- 0173US10607861B2Die separation using adhesive-layer laser scribingNXP BV·Filed 2017·Granted Mar 31, 2020·2 cites·13 claims
- 0231US2019229044A1Lead frame with plated lead tipsNXP BV·Filed 2018·Application pending·0 cites
- 0328US2018226353A1Semiconductor lead frame with machine readable markNXP BV·Filed 2017·Application pending·0 cites
- 0426US2019252256A1Non-leaded device singulationNXP BV·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →