Inventor · disambiguated record
Elstan Anthony Fernandez
Also filed as: FERNANDEZ ELSTAN A · FERNANDEZ ELSTAN ANTHONY
5 granted patents·3 pending applications·119 citations·filing 2000–2011
80Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG4FERNANDEZ ELSTAN A1FERNANDEZ ELSTAN ANTHONY1SEAH ALVIN1ST ASSEMBLY TEST SERVICES PTE1
Top patents by PatentIndex Score
8 records- 0188US6278613B1Copper pads for heat spreader attachST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Aug 21, 2001·94 cites·44 claims
- 0280US7224058B2Integrated circuit package employing a heat-spreader memberINFINEON TECHNOLOGIES AG·Filed 2005·Granted May 29, 2007·12 cites·20 claims
- 0373US7659620B2Integrated circuit package employing a flexible substrateINFINEON TECHNOLOGIES AG·Filed 2005·Granted Feb 9, 2010·7 cites·27 claims
- 0465US7880277B2Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assemblyINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 1, 2011·4 cites·9 claims
- 0556US8263438B2Method for connecting a die assembly to a substrate in an integrated circuitSEAH ALVIN·Filed 2011·Granted Sep 11, 2012·2 cites·23 claims
- 0638US2007205495A1Electronic Component With Stacked Semiconductor Chips And Heat Dissipating MeansFERNANDEZ ELSTAN ANTHONY·Filed 2007·Application pending·0 cites
- 0733US2006012035A1Method of packaging integrated circuits, and integrated circuit packages produced by the methodINFINEON TECHNOLOGIES AG·Filed 2002·Application pending·0 cites
- 0831US2006012031A1Heat dissipation device for integrated circuitsFERNANDEZ ELSTAN A·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →