Inventor · disambiguated record
Elizabeth Jacobs
Also filed as: JACOBS ELIZABETH · JACOBS ELIZABETH G
7 granted patents·112 citations·filing 1997–2014
85Inventor score
Top patents by PatentIndex Score
7 records- 0174US5894173AStress relief matrix for integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 1997·Granted Apr 13, 1999·49 cites·13 claims
- 0268US6580170B2Semiconductor device protective overcoat with enhanced adhesion to polymeric materialsTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 17, 2003·13 cites·17 claims
- 0366US6730541B2Wafer-scale assembly of chip-size packagesTEXAS INSTRUMENTS INC·Filed 1998·Granted May 4, 2004·33 cites·7 claims
- 0465US6787397B2Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabricationTEXAS INSTRUMENTS INC·Filed 2003·Granted Sep 7, 2004·11 cites·10 claims
- 0562US10168863B2Component specifying and selection apparatus and method using intelligent graphic type selection interfaceSIEMENS INDUSTRY INC·Filed 2014·Granted Jan 1, 2019·2 cites·15 claims
- 0655US8930821B2Component specifying and selection apparatus and method using intelligent graphic type selection interfaceBLACKHAM BYRAN·Filed 2012·Granted Jan 6, 2015·2 cites·16 claims
- 0731US6096578AStress relief matrix for integrated circuit packagingTEXAS INSTRUMENTS INC·Filed 1999·Granted Aug 1, 2000·2 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →