Inventor · disambiguated record
Elmer Dimaculangan Perez
Also filed as: PEREZ ELMER DIMACULANGAN
8 granted patents·4 pending applications·7 citations·filing 2008–2021
77Inventor score
Top patents by PatentIndex Score
12 records- 0172US12059898B2MEMS chip assembly having multiple trenchesMEMJET TECHNOLOGY LTD·Filed 2020·Granted Aug 13, 2024·0 cites·16 claims
- 0268US10864733B2Inkjet printhead with encapsulant-retaining featuresMEMJET TECHNOLOGY LTD·Filed 2019·Granted Dec 15, 2020·0 cites·16 claims
- 0368US10850517B2Inkjet printhead with grout retaining featuresMEMJET TECHNOLOGY LTD·Filed 2019·Granted Dec 1, 2020·0 cites·18 claims
- 0466US7915091B2Method of controlling satellite drops from an encapsulant jetterSILVERBROOK RES PTY LTD·Filed 2009·Granted Mar 29, 2011·4 cites·20 claims
- 0560US10870278B2Inkjet printhead with sealed shield plateMEMJET TECHNOLOGY LTD·Filed 2019·Granted Dec 22, 2020·0 cites·8 claims
- 0654US8322207B2Tack adhesion testing deviceCHEW NADINE LEE-YEN·Filed 2009·Granted Dec 4, 2012·3 cites·6 claims
- 0744US11701883B2Inkjet printhead having robust encapsulation of wirebondsMEMJET TECHNOLOGY LTD·Filed 2021·Granted Jul 18, 2023·0 cites·17 claims
- 0844US8017450B2Method of forming assymetrical encapsulant beadSILVERBROOK RES PTY LTD·Filed 2009·Granted Sep 13, 2011·0 cites·16 claims
- 0942US2010075464A1Method of reducing voids in encapsulantSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 1042US2010075465A1Method of reducing voids in encapsulantSILVERBROOK RES PTY LTD·Filed 2009·Application pending·0 cites
- 1142US2010075446A1Method of forming assymetrical encapsulant beadSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
- 1240US2010071456A1Tack adhesion testing deviceSILVERBROOK RES PTY LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →