Inventor · disambiguated record
Elaine B. Reyes
Also filed as: REYES ELAINE B · REYES ELAINE BAUTISTA
2 granted patents·1 pending application·3 citations·filing 2005–2007
47Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0155US7462943B2Semiconductor assembly for improved device warpage and solder ball coplanarityTEXAS INSTRUMENTS INC·Filed 2007·Granted Dec 9, 2008·2 cites·7 claims
- 0252US7244636B2Semiconductor assembly for improved device warpage and solder ball coplanarityTEXAS INSTRUMENTS INC·Filed 2005·Granted Jul 17, 2007·1 cites·6 claims
- 0333US2009206460A1Intermediate Bond Pad for Stacked Semiconductor Chip PackageREYES ELAINE BAUTISTA·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →