Inventor · disambiguated record
Ellen S. Tormey
Also filed as: TORMEY ELLEN S · TORMEY ELLEN SCHWARTZ
22 granted patents·3 pending applications·885 citations·filing 1986–2021
97Inventor score
Files withSARNOFF CORP8ALPHA ASSEMBLY SOLUTIONS INC4LAMINA CERAMICS INC3FERRO CORP2SARNOFF DAVID RES CENTER2
Top patents by PatentIndex Score
25 records- 0197US6455930B1Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technologyLAMINA CERAMICS INC·Filed 2000·Granted Sep 24, 2002·126 cites·8 claims
- 0293US8192047B2High color rendering index white LED light system using multi-wavelength pump sources and mixed phosphorsBAILEY EDWARD·Filed 2008·Granted Jun 5, 2012·36 cites·28 claims
- 0393US6713862B2Low temperature co-fired ceramic-metal packaging technologyLAMINA CERAMICS·Filed 2002·Granted Mar 30, 2004·67 cites·10 claims
- 0491US6739047B2Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrateLAMINA CERAMICS INC·Filed 2002·Granted May 25, 2004·61 cites·6 claims
- 0589US6518502B2Ceramic multilayer circuit boards mounted on a patterned metal support substrateLAMINA CERAMICS IN·Filed 2001·Granted Feb 11, 2003·66 cites·13 claims
- 0687US10562809B2Low K dielectric compositions for high frequency applicationsFERRO CORP·Filed 2018·Granted Feb 18, 2020·4 cites·17 claims
- 0784US9801285B2Solder preforms and solder alloy assembly methodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Oct 24, 2017·5 cites·8 claims
- 0883US6055151AMultilayer ceramic circuit boards including embedded componentsSARNOFF CORP·Filed 1998·Granted Apr 25, 2000·70 cites·25 claims
- 0982US5929510AIntegrated electronic circuitSARNOFF CORP·Filed 1997·Granted Jul 27, 1999·79 cites·9 claims
- 1081US5725808AMultilayer co-fired ceramic compositions and ceramic-on-metal circuit boardSARNOFF DAVID RES CENTER·Filed 1996·Granted Mar 10, 1998·64 cites·17 claims
- 1178US6399230B1Multilayer ceramic circuit boards with embedded resistorsSARNOFF CORP·Filed 1999·Granted Jun 4, 2002·50 cites·9 claims
- 1277US5953203AMultilayer ceramic circuit boards including embedded capacitorsSARNOFF CORP·Filed 1997·Granted Sep 14, 1999·50 cites·18 claims
- 1376US5866240AThick ceramic on metal multilayer circuit boardSARNOFF CORP·Filed 1997·Granted Feb 2, 1999·48 cites·14 claims
- 1474US6551720B2Materials to fabricate a high resolution plasma display back panelSARNOFF CORP·Filed 2001·Granted Apr 22, 2003·14 cites·1 claims
- 1572US7183640B2Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boardsLAMINA CERAMICS INC·Filed 2003·Granted Feb 27, 2007·17 cites·8 claims
- 1671US5958807ALow dielectric loss glass ceramic compositionsSARNOFF CORP·Filed 1997·Granted Sep 28, 1999·34 cites·4 claims
- 1770US6017642ALow dielectric loss glassesSARNOFF CORP·Filed 1997·Granted Jan 25, 2000·32 cites·6 claims
- 1863US5514451AConductive via fill inks for ceramic multilayer circuit boards on support substratesSARNOFF DAVID RES CENTER·Filed 1995·Granted May 7, 1996·29 cites·16 claims
- 1955US10625356B2Electrical connection tapeALPHA ASSEMBLY SOLUTIONS INC·Filed 2016·Granted Apr 21, 2020·0 cites·8 claims
- 2054US2022119315A1M7 LTCC-Silver System And Related Dielectric Compositions For High Frequency ApplicationsFERRO CORP·Filed 2021·Application pending·0 cites
- 2152US2018020554A1Solder Preforms and Solder Alloy Assembly MethodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Application pending·0 cites
- 2250US4769294AAlumina materials for low temperature co-sintering with refractory metallizationCERAMICS PROCESS SYSTEMS·Filed 1986·Granted Sep 6, 1988·19 cites·20 claims
- 2346US6191934B1High dielectric constant embedded capacitorsSARNOFF CORP & CO LTD·Filed 1998·Granted Feb 20, 2001·14 cites·19 claims
- 2437US10465295B2Jettable inks for solar cell and semiconductor fabricationALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Nov 5, 2019·0 cites·7 claims
- 2533US2014328039A1Systems and methods for void reduction in a solder jointALPHA METALS·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →