Inventor · disambiguated record
Elwyn P. M. Wakefield
Also filed as: WAKEFIELD ELWYN · WAKEFIELD ELWYN P M · WAKEFIELD ELWYN PAUL MICHAEL
7 granted patents·1 pending application·269 citations·filing 1990–2013
89Inventor score
Top patents by PatentIndex Score
8 records- 0186US5561594ACircuit connection in an electrical assemblySGS THOMSON MICROELECTRONICS·Filed 1995·Granted Oct 1, 1996·102 cites·22 claims
- 0274US5165067ASemiconductor chip packagesINMOS LTD·Filed 1991·Granted Nov 17, 1992·46 cites·51 claims
- 0366US5819398AMethod of manufacturing a ball grid array packageSGS THOMSON MICROELECTRONICS·Filed 1996·Granted Oct 13, 1998·35 cites·25 claims
- 0466US5512783ASemiconductor chip packagesINMOS LTD·Filed 1992·Granted Apr 30, 1996·32 cites·60 claims
- 0559US7137547B2Process for forming electrical/mechanical connectionsWAKEFIELD ELWYN PAUL MICHAEL·Filed 2001·Granted Nov 21, 2006·11 cites·21 claims
- 0658US5073816APackaging semiconductor chipsINMOS LTD·Filed 1990·Granted Dec 17, 1991·23 cites·11 claims
- 0755US6100581ASemiconductor chip packaging having printed circuitry or printed circuit registration featureINMOS LTD·Filed 1994·Granted Aug 8, 2000·20 cites·19 claims
- 0839US2015236232A1Led packageLITECOOL LTD·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Elwyn P. M. Wakefield files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →